PE and PV USA 2010 Covers Wide Range of Opportunities for PE



The field of printed electronics encompasses a tremendous array of applications, from thin-film photovoltaics and printed displays to printed batteries, sensors and so much more.

With an eye toward the latest applications for printed electronics and the newest technologies that will allow PE to move forward into production, IDTechEx is hosting Printed Electronics USA 2010 and Photovoltaics USA 2010, which will be held at the Santa Clara Convention Center, Santa Clara, CA, from Nov. 30-Dec. 2.

There has been noticeably more interest in PE in recent years, and Raghu Das, CEO of IDTechEx, said the show is likely to break the 1,000 mark in terms of unique visitors, a new record for the conference.

“Pre-registration as of Nov. 19 is 833 attendees from 28 countries,” Das said. “We had almost 300 people just register at the event on-site last year. We expect the same again and therefore we are confident that for the first time we will exceed 1,000 attendees, possibly as much as 1,200. We are also delighted that we are seeing increasingly large numbers of end users attend. Excluding press partners that are taking a booth, as of Nov. 19 there are 85 exhibitors.”

During the past year, there has been increased effort to bring PE products to the marketplace, and PE and PV USA 2010 is emphasizing these developments.

“A key highlight that we think will be very noticeable for attendees is the increased focus on products using printed electronics,” said Das. “For the first time, the exhibition will feature ‘Demonstration Street’ – a large area which will showcase many different types of working printed electronics products. The products displayed will range from products which are commercially sold to prototypes and samples that have been loaned to us for the event from companies all over the world - many are world-first previews of what is to come.”

“In addition, there will be some samples of working printed electronics products to keep,” Das added. “ These include several demonstrators that are being launched exclusively at this event demonstrating new capability not shown before. One of our aims of doing this was to draw in companies that are new to the technology but could use it in the businesses and products – to most, printed electronic is still a very new topic and there still needs to be a lot of education targeted towards potential end users.”

Conference Agenda

The conference begins on Wednesday, Dec. 1 with a series of keynote talks, starting with an overview on printed electronics by Das. He will be followed by a series of end-users, beginning with Jeff Duce, design engineer for Boeing; Eric Penot, digital media director for JCDecaux; Luis Rodrigo Pineiro, manager, technology exploration, and Gregory Nungester, engineer, for Crayola; and Dr. Marc Vermeersch, head of Dept. Solar & New Energies for TOTAL S.A. – Gas and Power.

After the break, keynote speakers will include Michael Londo, director of open innovation for MWV Packaging; James Zunino, ARDEC project officer/materials engineer for US Army ARDEC; Dr. Mike Woodhouse, solar energy materials scientist for NREL; and Dr. Vivek Subramanian, Associate Professor, Dept. of EECS, University of California, Berkeley, will lead talks ranging from smart packaging and military applications to solar cells and sensors.

After lunch, the conference breaks up into three concurrent sessions. Track 1 begins with talks centering on End Users (The Kraft Group and Cubic Security Systems) and Radical New Printed Electronics Products (Printechnologics, Soligie, GSI Technologies, Zed-Studio and T-Ink).

“Our conference program reflects the focus on end user needs and experiences with presentations from organizations such as Boeing, JCDecaux (a multi-billion dollar media/bill board company), Crayola, TOTAL, the U.S. Army, MeadWestvaco, Kraft Group, Cubic and many more,” Das said. “In addition, there will be many speakers from the printed electronics sector presenting in our session, ‘Radical New Printed Electronics Products.’”

Track 2 focuses on displays, with sessions on Progress with OLEDs (LG Display, Universal Display and Add-Vision); Touchscreens & Haptics (isiQiri interface technologies and Bayer MaterialScience – Artificial Muscle); and the Explosive E-Reader Market (E Ink, SiPix Imaging).

Track 3 covers the field of Photovoltaics - Thin Film Innovations (IBM, University of Alberta, Dyesol, SolarPrint, Plextronics, Panasonic Electric Works and Riso National Laboratory).

Day 2 features a wide variety of sessions encompassed in four concurrent tracks.

Track 1 includes sessions on Textiles (Eeonyx, Stanford University and University of California): stretchable electronics (MC10); Printed RFID (Kovio, PolyIC and Sunchon National University); Carbon Nanotubes (Vorbeck Materials, Brewer Science, Contour Energy System and SouthWest NanoTechnologies); MetaMaterials (California Institute of Technology); Security Applications (QSecure); and Printed Electronics EcoSystem (PARC, Soligie, VTT and IDTechEx).

Track 2 begins with Conformal/Flexible Displays (Cambridge Display Technology, Kent Displays, Liquavista and Sun Chemical); Healthcare (TagSense, Biomedical Diagnostics Institute and Information Mediary Corporation); Logic & Memory (Thin Film Electronics, 3M and Hewlett-Packard); and ITO Replacement (H.C. Starck Clevios, Agfa Materials and Eastman Kodak Company).

Track 3 focuses on photovoltaics, beginning with Photovoltaic Markets (IDTechEx and Navigant Consulting); Inorganic Photovoltaics (Ascent Solar, HelioVolt, Solterra Renewable Technologies, Stanford University, GE Global Research Center, Advanced Technology Group of Applied Materials, and Institute of Material Research and Engineering); and Laminar Batteries (The Paper Battery Company, Cymbet and Planar Energy Devices).

Track 4 features talks on Printing Electronics (Optomec, Korea Institute of Machinery and Materials, Jeju National University, Daetwyler R&D, OTB USA, NovaCentrix, Aixtron AG, Cabot Superior MicroPowders, EP Printing Systems and Innophysics BV); Insight from Material Suppliers (Orthogonal and Polyera Corporation); and Printed Silicon (University of Cape Town and NanoGram).