Meyer Burger to Showcase Full Range of Equipment at LOPEC
03.13.18
Will highlight PiXDRO inkjet printing equipment and FLEx thin film encapsulation technology.
During LOPEC, March 14-15, 2018 in Munich, Meyer Burger will present its full range of manufacturing equipment for printed and flexible electronics, including its PiXDRO inkjet printing equipment and FLEx thin film encapsulation technology.
Meyer Burger will showcase its state-of-the-art PiXDRO LP50 inkjet printer, the most advanced and versatile R&D desktop printer available in the market, supporting a wide range of industrial printheads for seamless transition of developed processes to mass production.
Fast developments in the industrialization of functional inkjet printing are driving innovation in printing equipment and processes. Due to its modular design, the JETx printers are ready for printing conductive, dielectric, resist, adhesive and other functional materials for applications in printed and flexible electronics, OLEDs, sensors, PCB, semiconductor packaging, chemical machining and photovoltaics.
Attendees will also discover Meyer Burger’s latest innovations in FLEx thin film encapsulation equipment and processes, providing a fully integrated CONx cluster solution for multi-layer barriers for OLEDs, OPV, batteries, and other sensitive flexible devices.
In addition, Erik Corduwener, Meyer Burger’s marketing and business development manager, will present a talk on “Advancements in Functional Inkjet Printing” on March 15 at 11:30 am - 12:00 pm in the Exhibitor Forum.
Meyer Burger will showcase its state-of-the-art PiXDRO LP50 inkjet printer, the most advanced and versatile R&D desktop printer available in the market, supporting a wide range of industrial printheads for seamless transition of developed processes to mass production.
Fast developments in the industrialization of functional inkjet printing are driving innovation in printing equipment and processes. Due to its modular design, the JETx printers are ready for printing conductive, dielectric, resist, adhesive and other functional materials for applications in printed and flexible electronics, OLEDs, sensors, PCB, semiconductor packaging, chemical machining and photovoltaics.
Attendees will also discover Meyer Burger’s latest innovations in FLEx thin film encapsulation equipment and processes, providing a fully integrated CONx cluster solution for multi-layer barriers for OLEDs, OPV, batteries, and other sensitive flexible devices.
In addition, Erik Corduwener, Meyer Burger’s marketing and business development manager, will present a talk on “Advancements in Functional Inkjet Printing” on March 15 at 11:30 am - 12:00 pm in the Exhibitor Forum.
