PE Europe 2017 Focuses on New Technologies and Worldwide Brands

By David Savastano, Editor | 05.09.17

Toyota, Coca-Cola, VF, HP and many other industry leaders will highlight the opportunities for emerging technologies.

Organized by IDTechEx, Printed Electronics Europe 2017 opens today in Berlin, Germany. With its focus on key growth areas such as flexible and printed electronics, sensors, wearables, the Internet of Things, 3D printing and more, PE Europe 2017 looks on course to expand again this year.
 
This year’s theme is “Connecting Emerging Technologies With Global Brands.” To show how these technologies offer opportunities for brand owners, speakers from major brands in wearables (VF, the owners of Timberland, Wrangler and Nautica, among others), biomedical (Galvani Bioelectronic, a JV from GlaxoSmithKline and Alphabet, Google’s parent company), automotive (Toyota, Jaguar Land Rover, Rolls Royce and Fiat) and consumer brands (HP, Coca-Cola, IBM, Jabil and JC Decaux) will provide insights into their experiences and requirements.
 
IDTechEx CEO Raghu Das reported that the conference is on pace to grow, with more than 3,000 attendees expected as well as 200 exhibitors and 225 presentations. Das said the growth of this year’s conference shows the opportunities in the market for flexible and printed electronics.
 
“The exhibition is now almost completely sold out and the exhibition space is more than 20% bigger than last year,” said Das. “Attendance is over 15% higher than this point last year before the show and that difference is growing.”
 
Printed Electronics Europe 2017 brings together a variety of inter-related topics, including 3D Printing Europe; Electric Vehicles; Energy Harvesting Europe; Energy Storage Innovations; Graphene & 2D Materials; Internet of Things Applications Europe; Sensors Europe and Wearable Europe.
 
“At Berlin, there is one large tradeshow and eight parallel tracks covering printed electronics materials and manufacturing, sensors, energy storage, additive printing, energy storage and then their applications include wearables, IoT and electric vehicles,” Das said. “Printed electronics is a key enabling technology and the co-location brings the whole value chain together in one place.”
 
The opening session, IDTechEx Show! Cornerstones, will present talks by end users, who will offer their insights into the technology. After an overview by Das, Cornerstones start with Ben Cooper, senior manager research and testing for VF Global Innovation Center, who will discuss “The Future of Wearables.”
 
“Now that the hype is over, Cooper will cover how large clothing brands are pursuing wearable technology, particularly focusing on e-textiles,” said Das.
 
Sebastien Ouchouche, principal engineer, Galvani Bioelectronics, will cover “Road Mapping Bioelectronic Medicine.” Galvani Bioelectronics is a partnership between GlaxoSmithKline and Alphabet, Google’s parent company.
 
“Both are funding Galvani Bioelectronics with a whopping $675 million,” Das said. “Ouchouche will cover their activities tackling healthcare issues and creating an enormous business in the process with the linking of biosciences and electronics.”
 
Dr. Krisztian Flautner GM, Internet of Things Business for ARM, will analyze “From Flexible Electronics To Ubiquitous Electronics: New Needs, New Opportunities.” ARM was acquired last year by Softbank for $32 billion, and Das reported that ARM is enabling more things to be connected, from cars to home appliances.
 
“Mobility in a Changing World,” presented by Andy Fuchs, GM, Toyota Mobility Foundation - Europe, will close the Cornerstones session.
 
“Toyota Motor Corporation sold over 8.5 million vehicles last year with revenues of $236.8 billion,” Das noted. “Andy Fuchs will present on mobility innovation, covering insight from electric vehicles to new technologies such as structural electronics and energy independent vehicles which incorporate, for example, flexible solar.”
 
The conference then breaks into eight concurrent tracks, each starting with a presentation by an IDTechEx expert. Printed Electronics, the topic of Track 1, begins with its own Keynote Session, starting with an End User Insight Panel featuring leaders from JC Decaux, Electrolux and Fiat. The panel will be followed by speakers from Jaguar Land Rover Research and The Coca-Cola Company.
 
The Printed Electronics track then discusses Structural Electronics, with talks from Fiat Research Center, TactoTek, DoMicro BV, TNO and the University of Massachusetts Lowell. The final topic of Track 1, Hybrid Electronics, will be covered by speakers from Jabil, Fraunhofer EMFT, Nano Dimension and X-Celeprint.
 
Track 2 covers Sensors. The Sensor Keynotes include talks by IDT, Fujitsu Laboratories Ltd. and University of Twente. After lunch, the Sensors track will feature two subjects, Flexible Sensors and Biometric ID Sensors. Flexible Sensors will be covered by Optomec, Joanneum Research, Tacterion GmbH, Empa, Swiss Federal Lab for Materials Science and Holst Centre/TNO. Biometric ID Sensors will feature presenters from Vocalzoom, Synaptics, Biowatch SA and ISORG.
 
Track 3 will focus on Wearables. Keynote talks will be given by cosinuss°, Cambridge Mechatronics Ltd. and innovation.rocks. The topic of Augmented Reality and Virtual Reality will cover the entire afternoon, with experts presenting from Nilasphere, Siemens AG, CERTH, Forum8, Fraunhofer FEP, CEA Leti, MICROOLED, Optinvent and Lumus.
 
Internet of Things is the topic of Track 4, with presentations by Hewlett Packard Enterprise, Rolls-Royce Deutschland Ltd & Co KG and IBM slated.
 
During the afternoon session, the first segment will be Internet of Things by Industry, featuring Raspberry Pi, Qorvo. Libellium and ARM Ltd., followed by a session on Software for Internet of Things, which will be covered by Oracle, DevicePilot, RT Soft Gmbh and Berlin Partner for Business and Technology.
 
Track 5, 3D Printing, starts with keynote talks by industry leaders Formlabs, Autodesk and Stratysys. After lunch, Track 5 then moves into the subject of Graphene, with Graphene keynote talks from Alpha Assembly Solutions, Talga Resources, Imagine Intelligent Materials Pty Ltd. and Standard Graphene. Graphene Applications, the final session of the day for Track 5, will feature presentations by Versarien Plc, GrapheneTech, NanoXplore GmbH and Thomas Swan & Co. Ltd.
 
Track 6, the Energy Harvesting session, features keynotes speakers from Altro Ltd. and Georgia Institute of Technology. Applications of Energy Harvesting in a Smarter World, which opens the post-luch program, will offer talks from Enocean GmbH, DELTA, Fraunhofer IIS, Analog Devices and Vrije Universiteit Brussel. Vibration Energy Harvesting will feature presentations from 8power Limited, Institute of Dynamics and Vibration Research (IDS), Jennova and Kinergizer.
 
Energy Storage Innovations will be the subject of Track 7, featuring speakers from Toyota Motor Europe, Electrovaya Maya and Ilika Technologies Ltd. Thin-Film Batteries and Solid State Batteries, the first afternoon segment, will be covered by STMicroelectronics, Fraunhofer IFAM, Zinergy UK Ltd., Empa and ULVAC. The second topic, Redox Flow Batteries, will be analyzed by presenters from Friedrich Schiller University Jena and EleStor.
 
 
Track 8, Electric Vehicles, begins with keynote talks by AVL, Mitsubishi Motors R&D Europe GmbH and ACM - Adaptive City Mobility. Energy Independent Vehicles will be covered by Solar Team Great Britain, Solar Team Eindhoven, Sono Motors, Nuon Solar Team and Interactive Fully Electrical Vehicles. The closing session, Advanced Next Generation Components, will feature talks byARADEX, Protean Electric, Equipmake Ltd. and Libralato Ltd.