PrintMarch 31, 2009
Optomec Wins Air Force Project to Eliminate Solder in Electronics
An aerosol jet deposition system will be used to fully print electronic circuitry, including active and passive components and interconnects. continue reading »
OMET Donates a Press to Clemson’s New Packaging Institute
The new VaryFlex press will be central to the Sonoco Institute’s focus on printed electronics. continue reading »
3M Dynatel Introduces New iD Marker Writing Station for RFID Marking of Underground Utilities
3M iD marker system is first of its kind in the industry continue reading »
SCHOTT Introduces Next Generation LLS LED Light Source
Longer life, lower energy consumption, higher performance continue reading »
Fraunhofer Institute for Telecommunications, HHI Orders AIXTRON MOCVD Tool for InP Photonics
Ordered one AIX 2600G3 IC MOCVD system for the multi-wafer growth of indium phosphide (InP) based optoelectronic devices continue reading »
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