July 13, 2010
Applied Materials to Highlight Innovations for Enabling Future Electronic Devices in San Francisco This Week
Will showcase its leadership and innovation for producing future generations of microchips and clean energy solutions continue reading »
Applied Materials Sees Record Adoption of New AdvantEdge Silicon Etch Technology
Critical technical capability of system in demand for next DRAM, Flash and Logic devices continue reading »
Bayer MaterialScience Joins Holst Centre Flexible Electronics Research
Bayer exchanges its own expertise with the existing network of academic and industrial partners continue reading »
NXP, Applied Materials Sign Comprehensive Service Contract
Will provide NXP with committed system uptime for more than 70 Applied Materials systems in NXP’s 8-inch wafer facility continue reading »
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