July 13, 2010



Applied Materials to Highlight Innovations for Enabling Future Electronic Devices in San Francisco This Week


Will showcase its leadership and innovation for producing future generations of microchips and clean energy solutions   continue reading »

Applied Materials Sees Record Adoption of New AdvantEdge Silicon Etch Technology


Critical technical capability of system in demand for next DRAM, Flash and Logic devices   continue reading »

Bayer MaterialScience Joins Holst Centre Flexible Electronics Research


Bayer exchanges its own expertise with the existing network of academic and industrial partners   continue reading »

NXP, Applied Materials Sign Comprehensive Service Contract


Will provide NXP with committed system uptime for more than 70 Applied Materials systems in NXP’s 8-inch wafer facility   continue reading »

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