Engineered Conductive Materials, LLC (ECM) introduced SolAg DB-1541-J Jet Dispensable, Interconnect Adhesive. The rheology of DB-1541-J is suitable for rapid, high volume dispensing for solar module interconnects.

DB-1541-J offers excellent adhesion to metals and other substrates. DB-1541-J also offers low out gassing for a void-free bond line, stable contact resistance after conditioning, is easy to dispense and is tough with outstanding peel strength. DB-1541-J is designed to survive IEC damp heat testing.