MFLEX, Austria Technologie Launch Strategic Alliance to Jointly Manufacture High Density Interconnect Rigid-Flex Printed Circuits

Posted on January 19, 2012 @ 02:51 pm

Multi-Fineline Electronix, Inc. (MFLEX) and Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S), announced a Strategic Alliance Agreement between the two parties. The resulting alliance will enable the parties to offer best-in-class high density interconnect (HDI) rigid-flex printed circuits for electronic devices and positions both companies to tap new opportunities in additional applications beyond their current offerings.

Both companies will continue to pursue increasing market opportunities in their core business, while providing this sophisticated solution as an addition to their product offerings. The alliance allows OEM's to fully utilize MFLEX and AT&S's expertise in complex flexible circuits and HDI rigid printed circuit board technology, respectively, to create technology demanding solutions for HDI rigid-flex printed circuits.

"As global technology leaders, AT&S and MFLEX are leveraging the strengths of each company to jointly manufacture best-in-class HDI rigid-flex printed circuits with assembly capabilities to meet the market needs for complex interconnect solutions. Having commenced initial production of HDI rigid-flex printed circuits, we are excited by the new business prospects this alliance opens to both companies as we expand into new applications with advanced technology products to serve both existing and new customers," said MFLEX CEO Reza Meshgin.

"We are excited about the synergy between MFLEX's core strength in flex circuits and assemblies and AT&S's core strength in HDI printed circuit board technology to bring HDI rigid-flex printed circuits to market. This cooperation is another important step in our strategy to become an industry leader for technology and innovation. To our customers, this alliance offers new opportunities in design and applications," said AT&S CEO Andreas Gerstenmayer.


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