Applied Nanotech Unveils ThercoBond Family of Highly Thermally-Conductive Bonding Materials


Posted on May 21, 2012 @ 08:42 am



Applied Nanotech Holdings, Inc. announced that it has unveiled a new family of highly thermally-conductive bonding and printed materials called ThercoBond for power electronics and photonics applications.

ThercoBond materials are specially designed for power electronic device packaging and dielectric coating, with an optimal combination of thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability and printability.

“The implementation of new thermal interface composites with a significantly higher level of heat dissipation performance is critical for the extreme requirements of power electronic devices today” said Dr. Nan (David) Jiang, director of the Thermal Management Division at Applied Nanotech, Inc. “The scope of industrial and commercial applications for ThercoBond materials is immense, starting with electronic packaging, power LEDs and PCB assembly, just to name a few.”

ThercoBond materials can easily be applied on various substrates by conventional screen printing, drawdown, and even inkjet and other printing approaches to form thermally conductive dielectric layers for printed circuit board (PCB) applications as well as other electronic packaging needs. The first two products in the ThercoBond family are polymer-based (DTC-P) and ceramic-based (DTC-C).

“With the global market for thermal interface materials projected to be over $600 million by the year 2016, the potential market for ThercoBond materials is very large,” said Doug Baker, CEO of Applied Nanotech Holdings, Inc. “The ThercoBond family of products now joins our award-winning thermal management material CarbAl and our ultra-strong adhesive CNTstix in our growing list of superior performance products based on our nanotechnology innovations. We are well on the way to achieving our commercialization and revenue goals we set for ourselves this year.”

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