Login
Join
FOLLOW:
Subscribe Free
eNewsletter
Checkout
Menu
Magazine
News
Printed Electronics
Raw Materials
Equipment
Services
Suppliers Guide
Resources
More
Magazine
News
Printed Electronics
Raw Materials
Equipment
Services
Suppliers Guide
Resources
Current & Past Issues
Features
Editorials
Digital Edition
Subscribe Now
Advertise Now
eNewsletter Archive
Our Team
Editorial Guidelines
Breaking News
Experts Opinion
Financial News
Manufacturers News
Mergers and Acquisitions
Online Exclusives
Personnel
Product Releases
Suppliers News
Live From Shows
Displays and Lighting
Photovoltaics
Printed Batteries
Printed Circuit Boards/Membrane Switches/In Mold Electronics
Flexible and Printed Electronics
RFID and NFC
Sensors and Wearables
Smart Cards and Packaging
Touch Screens
Adhesives, Barriers and Encapsulants
Chemicals, Metals and Powders
Conductive Inks and Coatings
Electronic Materials
Film, Paper, Glass and Substrates
Graphene, Perovskites and Carbon Nanotubes
Nanomaterials
Printed Electronic Components
Research Reports
Semiconductors and Quantum Dots
Energy Curing Equipment
Lab and Testing Equipment
Manufacturing Equipment
Printing Equipment
3D Printing
Contract Manufacturing Services
Product Design and Testing
Research and Consulting
Research Institutions
Research Reports
Universities
Equipment
All Companies
Materials
Categories
Converting
Printed Electronics Systems
Associations
Research and Services
Used Machinery
Add New Company
Industry Events
Live from show events
Podcasts
Videos
Blogs
Slideshows
Infographics
Webinars
Whitepapers
Equipment and Services
Glossary
Magazine
Current & Past Issues
Features
Editorial
Columns
Digital Edition
eNewsletter Archive
Editorial Guidelines
Subscribe Now
Advertise Now
Breaking News
Suppliers Guide
Suppliers Guide
Add Your Company
Printed Electronics
Photovoltaics
Printed Batteries
Printed Circuit Boards/Membrane Switches/In Mold Electronics
Flexible and Printed Electronics
RFID and NFC
Sensors and Wearables
Smart Cards and Packaging
Touch Screens
Raw Materials
Adhesives, Barriers and Encapsulants
Chemicals, Metals and Powders
Conductive Inks and Coatings
Electronic Materials
Film, Paper, Glass and Substrates
Graphene, Perovskites and Carbon Nanotubes
Nanomaterials
Semiconductors and Quantum Dots
Equipment
Energy Curing Equipment
Lab and Testing Equipment
Manufacturing Equipment
Printing Equipment
3D Printing
Services
Contract Manufacturing Services
Product Design and Testing
Research and Consulting
Research Institutions
Research Reports
Universities
Online Exclusives
Slideshows
Blog
Videos
Podcasts
Infographics
Events
Industry Events
Live from show events
Webinars
About Us
About Us
Contact Us
Advertise With Us
Privacy Policy
Terms of Use
Research Institutions
Online Exclusives
All
Consulting
Contract Manufacturing/Printing
Product Design and Testing
Research Institutions
Research Reports
Universities
Breaking News
|
Personnel
|
Research Institutions
Forrest Hoffman Recognized by IEEE as Senior Member
Senior membership, the IEEE’s highest grade, recognizes veteran scientists, engineers and others.
04.19.24
Breaking News
|
Personnel
|
Research Institutions
SRI Names Patrick Lincoln Division President
The industry veteran and SRI Fellow will lead SRI’s Information & Computing Sciences division.
04.11.24
Breaking News
|
Personnel
|
Research Institutions
Charles ‘Charlie’ Mathis Joins SRI’s Board of Directors
Mathis brings decades of experience in finance and accounting and US government contracting with both public and private companies.
04.02.24
Breaking News
|
Flexible and Printed Electronics
|
Research Institutions
Fraunhofer IPMS Designs Customized Silicon Chips
New silicon chips from Saxony are ideal for material characterization of printed electronics.
03.27.24
Breaking News
|
Research Institutions
|
Sensors and Wearables
Fraunhofer IPMS Develops New Multi-Sensor System for Water Analysis
The novel ISFET from Fraunhofer IPMS is based on metal-oxide-semiconductor (MOS) field-effect transistor technology.
03.21.24
Breaking News
|
Research Institutions
|
Semiconductors and Quantum Dots
Imec to Set Up New 300mm R&D Process Line in Andalusia
New R&D facility will complement imec’s 300mm cleanroom in Leuven with new processes and materials.
03.14.24
Breaking News
|
Displays and Lighting
|
Research Institutions
|
Sensors and Wearables
Fraunhofer IPMS Adds Microdisplays & Sensors Business Unit of Fraunhofer FEP
Fraunhofer IPMS anticipates the creation of synergies that will strengthen the research field and expedite development.
03.07.24
Breaking News
|
Research Institutions
|
Sensors and Wearables
Fraunhofer IPMS Highlights Innovation in Sensor Technology
Develops a new pH sensing layer successfully integrated into an ISFET.
03.04.24
Breaking News
|
Research Institutions
SRI Relaunches the PARC Forum
The PARC Forum brings together some of the world’s leading thinkers for thought-provoking conversations.
02.29.24
Breaking News
|
Research Institutions
|
Semiconductors and Quantum Dots
Imec Looks to Reduce CO2 Equivalent Footprint of Lithography, Etch
Imec presents levers to reduce the CO2 equivalent footprint of lithography and etch for advanced technology nodes.
02.27.24
Breaking News
|
Research Institutions
Imec Introduces Compact Wireless Powering Technology
Technology features record low energy consumption, paving the way to miniaturized and minimally invasive neural implants.
02.19.24
Breaking News
|
Personnel
|
Research Institutions
SRI CEO David Parekh Named to 2024 ‘Power 100’ List
The list highlights individuals who are ‘key to the future of the region, the Bay Area and … the world.’
02.15.24
Breaking News
|
Personnel
|
Research Institutions
James Fritz to Join SRI as SVP, Federal and Strategic Program Development
Fritz brings to SRI experience across a range of aerospace and commercial sectors.
02.14.24
Breaking News
|
Research Institutions
NREL’s Martin Keller Named Lab Director of the Year
Honored by Federal Laboratory Consortium for Technology Transfer.
02.07.24
Breaking News
|
Research Institutions
Employee-led Giving at ORNL Nets $967,871 for Area Nonprofits
ORNL employees recorded more than 1,497 volunteer hours, serving 56 nonprofits.
02.01.24
Breaking News
|
Displays and Lighting
|
Research Institutions
Fraunhofer FEP Shows High-Speed Light Modulation for Arrays
Develops high-speed light modulation for OLED, micro-LED and LCOS arrays.
01.26.24
Breaking News
|
Research Institutions
|
Sensors and Wearables
UNIST Shows Closed-Loop Recycling of Organic Flexible Electronics
Closed-loop recycling of organic flexible electronic devices paves the way for sustainable wearable electronics.
JooHyeon Heo, Public Relations Team, UNIST
01.25.24
Breaking News
|
Personnel
|
Research Institutions
SRI Names David Motley Board Chairman
Steven H. Walker, Lockheed Martin CTO and former DARPA director, joins the board.
01.22.24
Breaking News
|
Research Institutions
SRI Announces Its Newest Division: The Future Concepts Division
The division is composed of the research group that made up the Palo Alto Research Center (PARC).
01.19.24
Breaking News
|
Displays and Lighting
|
Flexible and Printed Electronics
|
Research Institutions
Jabil Expands Digital Commerce Capabilities at Chihuahua, Mexico Site
Jabil’s retail industry leadership reinforced by expanded manufacturing in North America, ongoing investment in digitalization.
01.15.24
Breaking News
Forrest Hoffman Recognized by IEEE as Senior Member
SKZ, Fraunhofer IAP Develop New Types of Powder for 3D Printing
SEMI Applauds CHIPS Program Progress
Universal Display Honored by BOE
HID Recognized as a Leader in 2024 Magic Quadrant
View Breaking News >
CURRENT ISSUE
Winter 2021
Printed Electronics Now’s International Suppliers’ Directory
The Automotive Market and Flexible and Printed Electronics
Flexible and Printed Electronics in Healthcare
Flexible and Printed Electronics Make Gains in Smart Packaging
PAPERONICS: Low-cost multisensory paper and packaging applications
View More >