Kerry Pianoforte12.01.11
Mike O’Reilly, Optomec Aerosol Jet Product Manager, will give a presentation titled “Aerosol Jet - 3D Interconnect and Conformal Applications” in the 3D Printed Electronics Track at the IDTechEx Printed Electronics Conference. The conference will be held from Nov. 30-Dec. 1 at the Santa Clara Convention Center in California. Aerosol Jet Systems will be showcased in booth B-102.
O’Reilly’s presentation will explain how Aerosol Jet systems are being used for 2D and 3D printing applications. He will also discuss how Aerosol Jet solutions enable conformal printing of high density 3D interconnects for multi-chip packages. Cost and functional advantages over wire bonding/TSV will also be highlighted. O’Reilly will discuss other Aerosol Jet System printing applications such as 3D interconnects for HB-LEDs, thin film conformal coating on 3D surfaces, printed sensors and antennae and more.
O’Reilly’s presentation will explain how Aerosol Jet systems are being used for 2D and 3D printing applications. He will also discuss how Aerosol Jet solutions enable conformal printing of high density 3D interconnects for multi-chip packages. Cost and functional advantages over wire bonding/TSV will also be highlighted. O’Reilly will discuss other Aerosol Jet System printing applications such as 3D interconnects for HB-LEDs, thin film conformal coating on 3D surfaces, printed sensors and antennae and more.