Kerry Pianoforte02.09.12
Thin Film Electronics ASA (Thinfilm) and PARC, a Xerox company, announced that they have won the prestigious FlexTech Alliance Innovation Award for the world’s first working prototype of a printed, non-volatile memory device addressed with complementary organic circuits, the equivalent of CMOS circuitry.
The FlexTech Alliance FLEXI award for Achievement in Innovation is given to companies that are leading the development of the flexible, printed electronics and display industry with innovative and commercially viable technologies. Thinfilm Addressable Memory consists of Thinfilm’s printed memory and PARC’s transistors, and when combined with other electronic components, such as temperature sensors, displays, power sources, and antennas, can enable the “Internet of Things,” where everything is connected by a smart tag. The two companies first demonstrated the prototype in October of last year.
“We believe the successful demonstration of Addressable Memory was a key enabling moment for printed electronics and it is gratifying to see that FlexTech Alliance has recognized its importance,” said Davor Sutija, Thinfilm CEO. “With the recent announcement of our ecosystem consisting of temperature sensor, battery and display vendors, the delivery of integrated printed devices and smart tags for the Internet of things will soon be a reality.”
“Addressable memory is a key building block for printed electronics and is an important step in creating a new world of integrated, smart devices. We are pleased to see FlexTech Alliance recognize its importance and innovation in driving the printed electronics market forward,” said Ross Bringans, vice president, PARC Electronic Materials and Devices Laboratory.
Development of the Thinfilm Addressable Memory was partially funded by an industrial development grant from Innovation Norway. Also participating in the development program are Thinfilm partners Polyera, Solvay and Inktec.
The FlexTech Alliance FLEXI award for Achievement in Innovation is given to companies that are leading the development of the flexible, printed electronics and display industry with innovative and commercially viable technologies. Thinfilm Addressable Memory consists of Thinfilm’s printed memory and PARC’s transistors, and when combined with other electronic components, such as temperature sensors, displays, power sources, and antennas, can enable the “Internet of Things,” where everything is connected by a smart tag. The two companies first demonstrated the prototype in October of last year.
“We believe the successful demonstration of Addressable Memory was a key enabling moment for printed electronics and it is gratifying to see that FlexTech Alliance has recognized its importance,” said Davor Sutija, Thinfilm CEO. “With the recent announcement of our ecosystem consisting of temperature sensor, battery and display vendors, the delivery of integrated printed devices and smart tags for the Internet of things will soon be a reality.”
“Addressable memory is a key building block for printed electronics and is an important step in creating a new world of integrated, smart devices. We are pleased to see FlexTech Alliance recognize its importance and innovation in driving the printed electronics market forward,” said Ross Bringans, vice president, PARC Electronic Materials and Devices Laboratory.
Development of the Thinfilm Addressable Memory was partially funded by an industrial development grant from Innovation Norway. Also participating in the development program are Thinfilm partners Polyera, Solvay and Inktec.