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    Breaking News

    Ceradrop MGI Group, UC Berkeley EECS Announce Equipment Vendor Collaborations

    EECS adds advanced X-Series CeraPrinter, software solutions suite from Ceradrop

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    Dave Savastano11.20.14
    Ceradrop MGI Group announces equipment vendor collaborations with UC Berkeley College of Engineering, Electrical Engineering and Computer Sciences (EECS) with a state-of-the art newly remodel clean room lab facility on campus. Working closely with both Ceradrop’s French-based and local equipment process teams, the goal will be to enable new printing electronics equipment integrations, advance software features, and new printing capabilities going forward much like the mature semiconductor fabrications infrastructures of proven process optimization and solutions methodologies.

    Professor Vivek Subramanian and his Printed Electronics Group said, “Recently we have an opportunity to upgrade our own in-house research inkjet system and after extensive evaluation and careful considerations, we’ve selected the advance X-Series CeraPrinter and software solutions suite from Ceradrop”

    “This is an important demonstration resource facility now made available to Ceradrop MGI Group and our customers. Going forward, with the support of both Professor Vivek Subramania and Professor Anna Claudia Aria UC Berkeley research groups and are recognized leaders in their respective research work in physics and technology of organic semiconductors and their applications in displays, low cost electronics sensors, and actuator. It is the right needed resources for the inkjet printing electronics industry,” said Tim Luong, national sales manager for Ceradrop MGI Group.



    CeraPrinter equipment is a powerful tool allows to reach all types of materials deposition Inkjet processes in Printed Electronics and Smart 3D Printing. It provides high level of resolution thanks to its dynamic accuracy calibrated on the nozzle of +/- 3µm and repeatability < 1µm, whatever chosen deposition speed and printing direction.

    Moreover, as no manufacturer of printheads can now provide a panel of optimal heads for all inks used in Printed Electronics, the CeraPrinter equipment offers possibilities to its users to work without compromise and use the most appropriate printheads of the market for each material they wish to apply (Konica Minolta, Dimatix… etc.). A large panel of heads is available from low cost cartridge to industrial printhead, with a drop volume from 1 pL up to 150 pL, number of nozzles from 16 up to several thousands, permits to apply a great variety of inks (UV, solvent, aqueous, oil, aggressive fluid). The patented system of the head-holder “plug and play” with automatic motorized rotation allows embedding simultaneously many printheads that can be quickly changed with accuracy in each of the slots of the head-holder. This head-holder is designed to advance and integrate any future printhead of the market dedicated to Printed Electronics.

    In addition, CeraPrinter equipment can integrate several post processes in-line (IR, UV, NIR, photonics…etc.), in order to become a process tool “all in one” for full process development dedicated to Printed Electronics and Smart 3D Printing.

    CeraPrinter X-Serie is a high accuracy advanced materials deposition inkjet printer embedding several post-process technologies is the best all-in-one product of the market to understand all behaviors from inks formulation to final cured electronic components and to qualify small batches production.
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      Scenes from PE Europe 2017

      Scenes from PE Europe 2017

      Printed Electronics Europe 2017 showcased new technologies in flexible and printed electronics. (Photos courtesy of IDTechEx)
      05.24.17

    • Displays and Lighting | Flexible and Printed Electronics | Photovoltaics | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | RFID and NFC | Sensors and Wearables | Smart Cards and Packaging | Touch Screens

      PE Europe 2017 Reports Growth

      Attendance is up 10%, and number of exhibitors increased by more than 30%.
      David Savastano, Editor 05.17.17

    • 3D Printing | Adhesives, Barriers and Encapsulants | Chemicals, Metals and Powders | Conductive Inks and Coatings | Contract Manufacturing/Printing | Displays and Lighting | Electronic Materials | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Graphene, Perovskites and Carbon Nanotubes | Lab and Testing | Manufacturers News | Manufacturing | Nanomaterials | Photovoltaics | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Printing | Research Institutions | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Touch Screens | Universities

      PE Europe 2017 Brings Together Emerging Technologies

      Conference shows latest in flexible and printed electronics, sensors, e-textiles, 3D printing, graphene and more.
      David Savastano, Editor 05.10.17


    • Breaking News | Flexible and Printed Electronics | RFID and NFC | Smart Cards and Packaging

      RRD Shows CustomWave RFID Solutions Powered by Printed Electronics

      RRD leverages its global manufacturing footprint for high volume production and distribution.
      05.10.17

    • 3D Printing | Adhesives, Barriers and Encapsulants | Conductive Inks and Coatings | Contract Manufacturing/Printing | Displays and Lighting | Electronic Materials | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Graphene, Perovskites and Carbon Nanotubes | Lab and Testing | Manufacturers News | Manufacturing | Nanomaterials | Photovoltaics | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Printing | Product Design and Testing | Research Institutions | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Touch Screens | Universities

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      Toyota, Coca-Cola, VF, HP and many other industry leaders will highlight the opportunities for emerging technologies.
      David Savastano, Editor 05.09.17

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