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    Breaking News

    2015FLEX is Bringing Technology and Products to Market

    Highlights opportunities for flexible, printed and hybrid electronics

    Related CONTENT
    • FlexTech Releases Preliminary Agenda for 2015FLEX
    • 2016FLEX to Focus on Latest Advances in Flexible and Printed Electronics
    • Melissa Grupen-Shemansky Appointed SEMI’s CTO for Flexible Electronics and Advanced Packaging
    • FlexTech Completes Flexible Hybrid Electronics Projects With ENrG, nScrypt and PARC
    • 2016FLEX Europe Makes Its Debut
    02.16.15
    2015FLEX is the premier technology and applications conference for flexible, printed and hybrid electronics (FPHE)  - the enablers of IoT, wearables and a smarter, safer world. This year’s agenda reflects the broad impact of this field of electronics with multiple sessions on applications and products, as well as materials, tools and processing.

    The conference opens with several big-picture talks on markets for FPHE including displays, human performance monitoring and smart packaging. From there, the sessions split into multiple tracks with contributions from 100+ speakers in the areas of materials, processing, integration, substrates, conductors, adhesives, power generation and power storage.

    “Flex 2015 is an outstanding venue for answering two fundamental business questions: what are the opportunities in FPHE? And, who are the people and companies making it happen?” noted Michael Ciesinski, president and CEO of FlexTech Alliance, the event organizer. “Revealing technology advancements and explaining manufacturing solutions for industrial, consumer and medical product breakthroughs are the hallmark of the Flex Conference.”

    The technical conference is complemented by networking events and a dynamic exhibition where attendees engage in follow-up and business-related discussions, view hands on demonstrations on advanced equipment, and see samples of new materials and products.
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      The billings figure is 10.5 percent lower than the final December 2018 level of $2.1 billion.
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    • Breaking News | Displays and Lighting | Financial News
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      Total revenue was $247.4 million for the full year of 2018.
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    • Breaking News | Financial News | RFID and NFC
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      Impinj Reports 4Q, Full Year 2018 Financial Results

      Company reported revenue of $122.6 million, GAAP gross margin of 47.5% during 2018.
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      Sales for the quarter ended Jan. 31, 2019 were $282.4 million compared to $287.8 million in the same quarter last year.
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    • Breaking News | Financial News | Photovoltaics
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    • Breaking News | Displays and Lighting | Flexible and Printed Electronics | Universities

      SEMI-FlexTech Announces 2019 FLEXI Awards Winners in Flexible Hybrid Electronics

      American Semiconductor, FlexEnable, Mark Poliks and Keith Rollins are this year's honorees.
      02.21.19

    • Breaking News | Displays and Lighting | Research Institutions

      Fraunhofer FEP: Hybrid OLED Creates Innovative, Functional Luminous Surfaces

      Presenting hybrid flexible OLEDs integrated into textile designs within the EU-funded project PI-SCALE for the first time at LOPEC.
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    • 3D Printing | Breaking News
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    • 3D Printing | Breaking News | Manufacturing

      Arkema Showcases Collaborative Innovations in 3D Printing Technologies at TCT Asia 2019

      TCT Asia took place in Shanghai Feb. 21-23.
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    • Breaking News | Flexible and Printed Electronics | Printed Circuit Boards/Membrane Switches/In Mold Electronics

      TactoTek, Geely Design, CEVT Initiate Automotive Interiors Project in Printed, In-Mold Electronics

      Geely Design to lead Injection Molded Structural Electronics design solutions of interior smart surfaces with CEVT.
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    • Breaking News | RFID and NFC
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    • Breaking News | Semiconductors and Quantum Dots | Sensors and Wearables

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      The VD6281 is in production and available now from ST sales channels.
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    • Breaking News | Semiconductors and Quantum Dots

      American Semiconductor Launches Fully Flexible, Ultra Bluetooth IC

      The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth Low Energy (BLE) communication.
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    Breaking News
    • North American Semiconductor Equipment Industry Posts January 2019 Billings
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    View Breaking News >
    CURRENT ISSUE

    Fall 2018

    • Printed Electronics Now’s International Suppliers’ Directory
    • Brand Owners See Benefits of Smart Packaging
    • OLEDs, Quantum Dots Make Gains in the Display Market
    • New Opportunities for Flexible Sensors
    • Flexible Electronics Applied to the Development of Sensors
    • Conference Gives Glimpse into Future of Printed Electronics, Conductive Inks
    • View More >

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