Electronic circuit and packaging technology is used in all electronics and information and communication devices, having tremendous potential for widespread use in the future. The aim of the JPCA Show is to contribute to the overall development of the electronic circuit industry and related fields by presenting an exhibition of products, knowledge and solutions for electronics devices, IT devices and equipment, and large electronics (printed electronics, stretchable electronics, etc.)
At booth 2G-30, Toyochem will showcase its latest electronics-related materials that leverage the Toyo Ink Group’s materials design and advanced processing technologies, and offer solutions developed to meet the electronics engineering needs of customers and end-users.
LIOELM TSS series of electromagnetic shielding films is specially designed to meet strict shielding demands. The TSS200 series of shielding films provides a simplified two-layer shielding structure for superior gap-fill properties. The TSS300 series is ideal for customers who require thin-type films. LIOELM TSC200 series of conductive adhesive sheets demonstrates excellent conductivity and strong adhesion.
LIOELMTCL500/TSU500 series of low dielectric materials reduces transmission losses by using an original low-dielectric resin and contributes to the widening or narrowing of gaps between printed-circuit lines.
An updated lineup of printed electronics solutions, such as REXALPHA RA FS series of high-resolution conductive silver pastes for fine circuit pattern formations, will also be on display.
Toshihiko Tanaka, technical manager of Toyo Ink SC Holdings Co.’s Group Technology Center, Development Division, will lead a seminar on the latest trends in printed electronics on June 3, from 2 to 2:30 p.m., at I-corner, East Hall 6. This seminar is part of the PEC (Printed Electronics Convention) Japan program.
Shota Mori of Toyochem’s Polymer & Coating R&D Division, New Technology Department will introduce low-dielectric adhesive sheets for flexible printed circuit transmissions on June 5, from 2:50 to 3:20 p.m. at D-corner, East Hall 6. This seminar is part of the NPI Presentation program.