06.18.15
At VLSI 2015 Symposium in Kyoto, Japan, imec reported new results on nanowire FETs and quantum-well FinFETs towards post-FinFET multi-gate device solutions.
As the major portion of the industry adopts FinFETs as the workhorse transistor for 16nm and 14nm, researchers worldwide are looking into the limits of FinFETs and potential device solutions for the 7nm node and beyond. Two approaches, namely Gate-All-Around Nanowire (GAA NW) FETs, which offer significantly better short-channel electrostatics, and quantum-well FinFETs (with SiGe, Ge, or III-V channels), which achieve high carrier mobility, are promising options.
For the first time, imec demonstrated the integration of these novel device architectures with state-of-the-art technology modules like Replacement-Metal-Gate High-k (RMG-HK) and Self (Spacer)-Aligned Double-Patterned (SADP) dense fin structures.
Imec’s research into advanced logic scaling is performed with imec’s key partners in its core CMOS programs, including GLOBALFOUNDRIES, INTEL, Micron, Panasonic, Samsung, SK hynix, Sony and TSMC.
As the major portion of the industry adopts FinFETs as the workhorse transistor for 16nm and 14nm, researchers worldwide are looking into the limits of FinFETs and potential device solutions for the 7nm node and beyond. Two approaches, namely Gate-All-Around Nanowire (GAA NW) FETs, which offer significantly better short-channel electrostatics, and quantum-well FinFETs (with SiGe, Ge, or III-V channels), which achieve high carrier mobility, are promising options.
For the first time, imec demonstrated the integration of these novel device architectures with state-of-the-art technology modules like Replacement-Metal-Gate High-k (RMG-HK) and Self (Spacer)-Aligned Double-Patterned (SADP) dense fin structures.
Imec’s research into advanced logic scaling is performed with imec’s key partners in its core CMOS programs, including GLOBALFOUNDRIES, INTEL, Micron, Panasonic, Samsung, SK hynix, Sony and TSMC.
