09.08.15
Industry leaders will share new perspectives about printed electronics during the 2015 SGIA Printed Electronics Symposium (Atlanta, Nov. 3-4).
Craig Armiento of UMass Lowell, this year’s keynote speaker, is director of the Printed Electronics Research Collaborative, as well as the co-director of the Raytheon-UMass Lowell Research Institute. On Nov. 3, he will explore the growing interest in exploiting additive concepts for the production of electronics, as well as how the university is working with industry partners and the government to build out the supply chain for the printed electronics community.
“The additive manufacturing revolution has arrived, and it will change the form factor from today’s rigid circuit boards to electronics that are flexible, conformal, wearable and integrated into 3D objects,” said Armiento. “Printing electronically functional inks on non-conventional materials will expand the reach of electronics, as well as impact the paper, plastics and textile industries.”
Armiento will outline the technical challenges faced when transforming rigid electronic materials, components and systems into flexible form factors. Further, he will discuss on the opportunities to reduce design cycle time, shifting processes from time-consuming, mask-driven approaches to CAD-driven production methods.
Craig Armiento of UMass Lowell, this year’s keynote speaker, is director of the Printed Electronics Research Collaborative, as well as the co-director of the Raytheon-UMass Lowell Research Institute. On Nov. 3, he will explore the growing interest in exploiting additive concepts for the production of electronics, as well as how the university is working with industry partners and the government to build out the supply chain for the printed electronics community.
“The additive manufacturing revolution has arrived, and it will change the form factor from today’s rigid circuit boards to electronics that are flexible, conformal, wearable and integrated into 3D objects,” said Armiento. “Printing electronically functional inks on non-conventional materials will expand the reach of electronics, as well as impact the paper, plastics and textile industries.”
Armiento will outline the technical challenges faced when transforming rigid electronic materials, components and systems into flexible form factors. Further, he will discuss on the opportunities to reduce design cycle time, shifting processes from time-consuming, mask-driven approaches to CAD-driven production methods.
