• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Suppliers Guide
      • Add Your Company
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Breaking News

    Imec, Ghent University Show First Laser Arrays Monolithically Grown on 300mm Silicon Wafers

    Marks step towards next-generation photonic integrated circuit technology targeting advanced optical interconnects.

    Related Content
    • Space Mission Tests NREL Perovskite Solar Cells
    • LG Display’s OLED TV Panels Certified as Eco-Product by SGS
    • Modulight Opts for AIXTRON MOCVD System
    • Imec, Cascade Microtech Develop First Automatic Probe System for Advanced 3D Chips
    • Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics
    11.01.15
    Imec and Ghent University presented, for the first time, arrays of indium phosphide lasers monolithically integrated on 300mm silicon substrates in a CMOS pilot line. This achievement, published in Nature Photonics, provides a path toward high-volume manufacturing of cost-effective photonic integrated circuits (PICs) with monolithically integrated laser sources. Such laser-powered PICs will revolutionize data transfer between future logic and memory chips.
     
    Over the past few years, demand for data communication between servers in cloud datacenters has been growing exponentially, following strong growth in social networking, cloud computing and big data applications. Silicon photonics technology enables cost-effective manufacturing of fiber-optic transceivers, which in turn provides continued scaling of server and datacenter capacity with improved power efficiencies.
     
    However, wide-spread adoption of this technology has been hampered in part by the lack of monolithically integrated laser sources. The integration on silicon of efficient indium phosphide-based light sources, currently driving long-range telecommunication networks, is known to be very challenging, owing to the large mismatch in crystal lattice constants between both materials.
     
    Imec and Ghent University overcame these structural differences and largely suppressed the detrimental crystal defects that typically form at the interface between silicon and indium phosphide. Utilizing a production grade metal-organic vapor-phase epitaxial (MOVPE) growth reactor, indium phosphide semiconductor was selectively grown on silicon in a pre-patterned oxide template, realizing indium phosphide waveguide arrays across the entire 300mm substrate.
     
    Lasing operation was demonstrated for all tested devices consisting of an array of 10 indium phosphide lasers. Lasing performance showed small variability along the array, illustrating the high material quality of the heteroepitaxial grown indium phosphide.
     
    The newly demonstrated approach for integrating lasers with silicon has been carried out in imec’s 300mm CMOS pilot line facility, therefore providing a path to large volume manufacturing.
     
    This work has been carried out as part of imec’s industry affiliation program on Optical I/O, which targets the development of a scalable, silicon-based optical interconnect technology for high-bandwidth chip-level I/O. The work was also partly supported by the European Commission through an ERC starting grant awarded to Prof. D. Van Thourhout of Ghent University for research on Ultra Low Power Photonic ICs (ULPPIC).
    Related Searches
    • imec
    • semiconductor
    • devices
    Suggested For You
    Space Mission Tests NREL Perovskite Solar Cells Space Mission Tests NREL Perovskite Solar Cells
    LG Display’s OLED TV Panels Certified as Eco-Product by SGS LG Display’s OLED TV Panels Certified as Eco-Product by SGS
    Modulight Opts for AIXTRON MOCVD System Modulight Opts for AIXTRON MOCVD System
    Imec, Cascade Microtech Develop First Automatic Probe System for Advanced 3D Chips Imec, Cascade Microtech Develop First Automatic Probe System for Advanced 3D Chips
    Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics
    Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics
    Holst Centre Wins IDTechEx Printed Electronics Europe 2017 Award for IME Demonstrator Holst Centre Wins IDTechEx Printed Electronics Europe 2017 Award for IME Demonstrator
    Imec Develops Bifacial n-PERT Solar Cell with a Record 22.8% Front-Side Efficiency Imec Develops Bifacial n-PERT Solar Cell with a Record 22.8% Front-Side Efficiency
    Indigo Diabetes nv Announces Successful Series A Financing Round Indigo Diabetes nv Announces Successful Series A Financing Round
    Fashion Designer Jasna Rok Showcases Collection Based on Smart Plastics, Smart Textiles Fashion Designer Jasna Rok Showcases Collection Based on Smart Plastics, Smart Textiles
    Imec, Ghent University Present Thermoplastically Deformable Electronic Circuits Imec, Ghent University Present Thermoplastically Deformable Electronic Circuits
    Turning Clothing into Information Displays Turning Clothing into Information Displays
    European Collaboration Accelerates Silicon Photonics Prototyping Services European Collaboration Accelerates Silicon Photonics Prototyping Services
    Imec Demonstrates 50GHz Ge Waveguide Electro-Absorption Modulator Imec Demonstrates 50GHz Ge Waveguide Electro-Absorption Modulator
    Ghent University, imec and Collaborators Extend Spectrum of Frequency Comb Light Sources Ghent University, imec and Collaborators Extend Spectrum of Frequency Comb Light Sources

    Related Expert's Opinion

    • Breaking News | Graphene, Perovskites and Carbon Nanotubes | Photovoltaics
      Space Mission Tests NREL Perovskite Solar Cells

      Space Mission Tests NREL Perovskite Solar Cells

      The latest test will evaluate the potential use of perovskite solar cells in space and assess the durability of materials used in those cells.
      Wayne Hicks, NREL 08.30.21

    • Breaking News | Displays and Lighting
      LG Display’s OLED TV Panels Certified as Eco-Product by SGS

      LG Display’s OLED TV Panels Certified as Eco-Product by SGS

      OLED TV panels have been recognized as eco-friendly products with low emissions of hazardous substances.
      Printed Electronics Now staff 11.16.20

    • Breaking News | Manufacturing | Semiconductors and Quantum Dots
      Modulight Opts for AIXTRON MOCVD System

      Modulight Opts for AIXTRON MOCVD System

      Laser specialist from Finland scales up production of epi wafers.
      Printed Electronics Now Staff 10.26.20


    • 3D Printing | Breaking News | Research Institutions

      Imec, Cascade Microtech Develop First Automatic Probe System for Advanced 3D Chips

      Test system enables pre-bond probing of 3D chips with large-array fine-pitch micro-bumps.
      05.25.17

    • Breaking News | Research Institutions | Sensors and Wearables | Universities

      Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics

      Future advanced prosthetics under development will provide amputees with rich sensory content from artificial limbs.
      05.17.17

    Loading, Please Wait..
    Trending
    • Celanese Launches Nine New Conductive Inks
    • Weekly Recap: CES 2023, Ams OSRAM And Celanese Top This Week’s Stories
    • Tageos Introduces EOS-460 U9, New Tire Tagging RFID Inlays
    • Flex Recognized As One Of Fortune World’s Most Admired Companies 2023
    • Thin Film, Printed Battery Market Worth $296 Million by 2025: MarketsandMarkets
    Breaking News
    • Emerson Launches Ovation Green Software Portfolio
    • Graphene Flagship Researchers Examine Applications for Space
    • Weekly Recap: CES 2023, ams OSRAM and Celanese Top This Week’s Stories
    • Pixelligent Names Jeff Anderson as VP of Sales & Marketing
    • Flex Recognized as One of Fortune World’s Most Admired Companies 2023
    View Breaking News >
    CURRENT ISSUE

    Winter 2021

    • Printed Electronics Now’s International Suppliers’ Directory
    • The Automotive Market and Flexible and Printed Electronics
    • Flexible and Printed Electronics in Healthcare
    • Flexible and Printed Electronics Make Gains in Smart Packaging
    • PAPERONICS: Low-cost multisensory paper and packaging applications
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • About Us
    • Privacy Policy
    • Terms And Conditions
    • Contact Us

    follow us

    Subscribe
    Nutraceuticals World

    Latest Breaking News From Nutraceuticals World

    GOED Elects New Board Officers for 2023
    Aspire Hires Darrec Jones as VP of Business Development
    Pycnogenol Supplementation Linked to Better Hair Density in Menopausal Women
    Coatings World

    Latest Breaking News From Coatings World

    Caren Hoffmann Appointed Vice President for BASF Mining Solutions
    Microban International Announces Four Senior Hires
    PPG Completes COLORFUL COMMUNITIES Project in Denmark
    Medical Product Outsourcing

    Latest Breaking News From Medical Product Outsourcing

    Digital X-Ray is as Effective as Lung Ventilation Perfusion in Detecting CTEPH
    CIBC Innovation Banking Provides $25M in Debt Financing to Podimetrics
    Invacare's Interim CEO Permanently Secures Job
    Contract Pharma

    Latest Breaking News From Contract Pharma

    Astellas Announces New President and CEO and Management Structure
    Thermo Fisher, Celltrio Partner on Cell Line Automation Platform
    Lilly 4Q Revenues Down 9% to $7.3B
    Beauty Packaging

    Latest Breaking News From Beauty Packaging

    Interpack 2023 to Focus on Sustainability
    e.l.f. Cosmetics Unveils New Bold Satin Finish Lipstick
    Weekly Recap: L’Oréal & LVMH Bid for Aesop, Ariana Grande Purchases r.e.m. Beauty & More
    Happi

    Latest Breaking News From Happi

    Perfect Corp. Partners with Precision Skin by DermConcept to AI-Powered Digital Skin Diagnostic
    Old Spice Kicks Off ‘Smelf-Confidence’ Marketing Campaign During Super Bowl LVII
    Next of Us (NOU) Launches Moisturizing Cream and Reactivating Mist for Varied Curl Types
    Ink World

    Latest Breaking News From Ink World

    Fujifilm Expands Its RxD Inkjet Pigment Dispersions Color Range
    Weekly Recap: Pigments, Inkjet Ink Market Reports Top This Week’s Stories
    Roland DGA Announces Key Changes to Leadership Team
    Label & Narrow Web

    Latest Breaking News From Label & Narrow Web

    Fujifilm expands RxD inkjet pigment dispersions color range
    Anderson & Vreeland acquires flexo consumable assets from Grimco
    Hamillroad Software's Bellissima DMS honored in Brazil
    Nonwovens Industry

    Latest Breaking News From Nonwovens Industry

    Avgol to Showcase Algaeing Colorants and Fibers at Filtech
    Uster to Host Webinar on Zero-Level Contamination Control
    Typar Expands Drainable Wrap Line
    Orthopedic Design & Technology

    Latest Breaking News From Orthopedic Design & Technology

    Steady Growth Forecast for Global Orthobiologics Market
    ODT's Most-Read Stories This Week—Feb. 4
    Toetal Solutions Secures $1.8 Million in New Financing
    Printed Electronics Now

    Latest Breaking News From Printed Electronics Now

    Weekly Recap: CES 2023, ams OSRAM and Celanese Top This Week’s Stories
    Zebra Provides East West Shrine Bowl with RFID Tracking Technology
    AAAS Elects Three ORNL Scientists as Fellows

    Copyright © 2023 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login