The copper nanoparticle-based ink provides improved oxidation resistance, resulting in an innovative breakthrough that offers the ability to print copper with industrial 3D digital printers.
Copper is a highly electrically conductive metal, and its low price gives it a significant advantage in the market compared to silver. However, copper nanoparticles rapidly oxidize upon contact with air, which impairs the electrical conductivity.
The patent application that the company has filed presents approaches to overcome the problem of copper nanoparticle oxidation.
“Our conversations with hundreds of companies across different industrial sectors indicate a strong demand for our 3D printed electronics technology,” said Amit Dror, CEO of Nano Dimension. “The demand is not limited to prototyping, but also includes industrial scale manufacturing applications. The current global PCB market is estimated to be larger than USD $70 billion and is expected to reach about USD $100 billion in the coming years. A high-performance copper nanoparticle ink presents an opportunity to significantly impact this huge market.”