The company has developed an innovative approach to print objects in 3D that contain conductive traces – a process the new patent would cover. Nano Dimension was able to make this new technological development as a result of its work developing materials and 3D printers for multilayer PCB prototyping.
The sintering of a printed metal conductor within a 3D printed polymer allows for complex connectors to be 3D printed and also makes it possible to 3D print molded connectors directly onto electronic circuits. The newly developed process may also be applied to 3D printing of non-flat electronic circuits as well as structural objects with embedded electronic circuits.
The materials and processes required for 3D printing objects containing semiconductors may result in a significant breakthrough for the industry, enabling the creation of freeform electronic products that cannot be created using current circuit manufacturing technologies.