04.18.17
The Advanced Packaging & System Integration Technology Symposium will be held in Wuxi, China. Organized by Yole Développement and the National Center for Advanced Packaging (NCAP China), this event will focus on the field of advanced packaging and include the newest developments in fan-out packaging, system in package, advanced substrates, 3D technology and embedded technologies, as well as MEMS & sensors packaging, radio frequency, and photonics.
Dr. Tony D. Flaim, CTO for Brewer Science, will be the keynote speaker on Friday, April 21, at the Advanced Packaging & System Integration Technology Symposium. Dr. Flaim will speak from 9:00 a.m. to 9:45 a.m. on, “The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates.”
Dr. Flaim received a B.A. in pre-medicine from the University of Missouri – Columbia in 1974 and a Ph.D. in physical chemistry from the University of Missouri – Rolla in 1983. After working as a ssenior research chemist at Dow Chemical Corporation, he joined Brewer Science as a senior chemist in 1985. Since that time, he has played a prominent role in the development of the company’s innovative product portfolio that includes bottom anti-reflective coatings, polyimide lift-off layers, and wafer protection coatings.
Most recently, Dr. Flaim has directed the development of temporary wafer bonding materials and dielectric coatings for the production of advanced semiconductor packages and 2.5-D and 3-D integrated devices. He has served on the senior management team of Brewer Science since 2004 and was named CTO in early 2008. Dr. Flaim holds more than 25 patents on microelectronic and optoelectronic materials and has authored more than 20 related publications.
Dr. Tony D. Flaim, CTO for Brewer Science, will be the keynote speaker on Friday, April 21, at the Advanced Packaging & System Integration Technology Symposium. Dr. Flaim will speak from 9:00 a.m. to 9:45 a.m. on, “The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates.”
Dr. Flaim received a B.A. in pre-medicine from the University of Missouri – Columbia in 1974 and a Ph.D. in physical chemistry from the University of Missouri – Rolla in 1983. After working as a ssenior research chemist at Dow Chemical Corporation, he joined Brewer Science as a senior chemist in 1985. Since that time, he has played a prominent role in the development of the company’s innovative product portfolio that includes bottom anti-reflective coatings, polyimide lift-off layers, and wafer protection coatings.
Most recently, Dr. Flaim has directed the development of temporary wafer bonding materials and dielectric coatings for the production of advanced semiconductor packages and 2.5-D and 3-D integrated devices. He has served on the senior management team of Brewer Science since 2004 and was named CTO in early 2008. Dr. Flaim holds more than 25 patents on microelectronic and optoelectronic materials and has authored more than 20 related publications.
