• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Suppliers Guide
      • Add Your Company
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Breaking News

    Imec, Cascade Microtech Develop First Automatic Probe System for Advanced 3D Chips

    Test system enables pre-bond probing of 3D chips with large-array fine-pitch micro-bumps.

    05.25.17
    Imec and Cascade Microtech, a FormFactor company and a leader in advanced wafer-probe solutions, announced the successful development of a fully-automatic system for pre-bond testing of advanced 3D chips.
     
    Pre-bond testing is important to increase the yield of 3D stacked chips. The new system enables probing and hence testing of chips with large arrays of 40µm-pitch micro-bumps, on 300mm wafers. The relevance of this new tool is underlined by winning the 2017 National Instruments Engineering Impact Award.
     
    As an emerging technology, 3D IC stacking still has many open options and technical challenges. One of these challenges is probing of the individual chips, before being stacked, to ensure a good yield of the 3D stacked ICs. The inter-chip connections of 3D stacked ICs are made by large arrays of fine-pitch micro-bumps, which makes probing these bumps a challenge. Until today, the probing solution is to add dedicated pre-bond probe pads to the to-be-stacked dies, but this requires extra space and design effort and increases test time.
     
    Imec and Cascade Microtech have now developed a fully automatic test cell that can provide test access by probing large arrays of fine-pitch micro-bumps. The system is based on a Cascade Microtech CM300 probe station and National Instruments PXI test instrumentation. The system allows testing of wafers up to 300mm diameter, including thinned wafers on tape frame with exposed through-silicon vias. After several years of collaboration between imec and Cascade Microtech, partly supported by the EU-funded FP7 SEA4KET project, good results were achieved with Cascade Microtech’s Pyramid Probe prototype RBI probe cards on imec’s 300mm wafers with 40µm-pitch micro-bumped chips.
     
    “As everything in the semiconductor realm, also micro-bumps are subject to downscaling,” said Erik Jan Marinissen, principal scientist at imec. “Hence, with Cascade, we have started experiments to also probe our 20µm-pitch micro-bump arrays, and those look promising.”
     
    Related Searches
    • 3d
    • semiconductor
    • imec
    Suggested For You
    Imec and Holst Centre Present Solution for Precise Low-Cost Eye Movement Detection Imec and Holst Centre Present Solution for Precise Low-Cost Eye Movement Detection
    Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics
    Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics
    Printed Electronics on Display at LOPEC 2017 Printed Electronics on Display at LOPEC 2017
    Imec and Solliance’s Perovskite PV Modules Achieve 12.4% Imec and Solliance’s Perovskite PV Modules Achieve 12.4%
    Imec, Holst Centre Present New Digital Receiver Imec, Holst Centre Present New Digital Receiver
    Imec Presents Patterning Solutions for N5-equivalent Metal Layers Imec Presents Patterning Solutions for N5-equivalent Metal Layers
    Flemish Government Increases Financial Support of imec Flemish Government Increases Financial Support of imec
    Imec, Holst Centre and Cartamundi Introduce Plastic NFC Tag Communicating with Smartphones Imec, Holst Centre and Cartamundi Introduce Plastic NFC Tag Communicating with Smartphones
    Imec Introduces New Snapshot Multispectral Image Sensor Imec Introduces New Snapshot Multispectral Image Sensor
    Imec, EVG Demonstrate 1.8µm Pitch Overlay Accuracy for Wafer Bonding Imec, EVG Demonstrate 1.8µm Pitch Overlay Accuracy for Wafer Bonding
    imec, Antwerp and Flanders to Establish Smart City Living Lab imec, Antwerp and Flanders to Establish Smart City Living Lab
    Imec, Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules Imec, Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules
    Imec Collaborates with Google to Offer Cloud Access to Flemish Startups Imec Collaborates with Google to Offer Cloud Access to Flemish Startups
    Imec, Holst Centre Introduce World’s First Solid-State Multi-Ion Sensor for IoT Applications Imec, Holst Centre Introduce World’s First Solid-State Multi-Ion Sensor for IoT Applications

    Related Breaking News

    • Breaking News | Research Institutions | Sensors and Wearables

      Imec and Holst Centre Present Solution for Precise Low-Cost Eye Movement Detection

      Technology paves way to low-cost augmented reality, virtual reality applications.
      05.18.17

    • Breaking News | Research Institutions | Sensors and Wearables | Universities

      Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics

      Future advanced prosthetics under development will provide amputees with rich sensory content from artificial limbs.
      05.17.17

    • Research Institutions | Sensors and Wearables | Universities

      Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics

      Future advanced prosthetics under development will provide amputees with rich sensory content from artificial limbs.
      05.17.17


    • Displays and Lighting | Flexible and Printed Electronics | Manufacturers News | Photovoltaics | RFID and NFC | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Touch Screens
      Printed Electronics on Display at LOPEC 2017

      Printed Electronics on Display at LOPEC 2017

      Printed electronics were the highlight at LOPEC 2017 in Munich, Germany. (Photos courtesy of Messe Munchen)
      David Savastano, Editor 04.12.17

    • Breaking News | Photovoltaics | Research Institutions

      Imec and Solliance’s Perovskite PV Modules Achieve 12.4%

      Technology is developed with industrially applicable processes.
      04.11.17

    Loading, Please Wait..
    Trending
    • Nicolas Dufourcq Named STMicroelectronics Chairman
    • NXP Semiconductors Announces Changes To Board Of Directors
    • Heliatek Installs Façade At Samsung’s Advanced Institute Of Technology
    • Partner Workshops Start Solliance 2.0
    • Infineon Board Member Constanze Hufenbecher Will Not Extend Contract
    Breaking News
    • Partner Workshops Start Solliance 2.0
    • Weekly Recap: Smart Skis, Universal Display Top This Week’s Stories
    • Wiliot Appoints Antony Yousefian as VP of Climate & Circularity
    • HID Unveils Eco-friendly Bamboo Access Cards
    • NXP Semiconductors Announces Changes to Board of Directors
    View Breaking News >
    CURRENT ISSUE

    Winter 2021

    • Printed Electronics Now’s International Suppliers’ Directory
    • The Automotive Market and Flexible and Printed Electronics
    • Flexible and Printed Electronics in Healthcare
    • Flexible and Printed Electronics Make Gains in Smart Packaging
    • PAPERONICS: Low-cost multisensory paper and packaging applications
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • About Us
    • Privacy Policy
    • Terms And Conditions
    • Contact Us

    follow us

    Subscribe
    Nutraceuticals World

    Latest Breaking News From Nutraceuticals World

    Premium Label & Packaging Solutions Receives Safe Quality Food (SQF) Certification
    Inulinase Enzymes May Benefit Gut Symptoms of FODMAP Digestion
    Verdure Sciences’ Boswellia Ingredient Receives USP Verification
    Coatings World

    Latest Breaking News From Coatings World

    BASF Celebrates 10 Years of its Northeast Research Alliance in the U.S.
    BCF Elects Sharon Harte Its First Female President
    OQ Chemicals Launches Cost-Cutting Program and Organizational Realignment in Germany
    Medical Product Outsourcing

    Latest Breaking News From Medical Product Outsourcing

    Vascular Surgeon Imprisoned and Fined for Decade-Long Healthcare Fraud
    Remote Monitoring, Digital Health Help Advance Wound Care Treatment
    MLM Biologics Developing Wound Infection Prevention Device for Military
    Contract Pharma

    Latest Breaking News From Contract Pharma

    Catalent Adds New Cryogenic Capabilities at Japanese Facility
    Lifecore Biomedical Enters into $150M New Financing Deal
    WuXi Biologics Receives 2023 ISPE Facility of the Year Award
    Beauty Packaging

    Latest Breaking News From Beauty Packaging

    How Robots & Artificial Intelligence are Transforming Unilever's Material Innovation Factory
    Top 10 Most Popular Hair Care Brands in the U.S.—Ranked by Searches
    Aloette Cosmetics Launches Daily Mineral Shield Sunscreen
    Happi

    Latest Breaking News From Happi

    Kérastase Donates $25,000 to The Trevor Project
    Aveda Launches Hypernature Artist Collection
    Amika Leads as the Most Popular Hair Care Brand in the US: Curl Centric
    Ink World

    Latest Breaking News From Ink World

    BCF Elects Sharon Harte First Female President in Its History
    Weekly Recap: INX Digital, Mexar and hubergroup Top This Week’s Stories
    Richnerstutz AG Acquires an EFI VUTEk Q5r Superwide Roll-to-Roll Printer
    Label & Narrow Web

    Latest Breaking News From Label & Narrow Web

    Mactac acquires Label Supply, Beontag grows and more
    Sun Chemical releases Spring 2023 Regulatory Newsletter
    Tageos unveils new RAIN RFID inlays
    Nonwovens Industry

    Latest Breaking News From Nonwovens Industry

    Weekly Recap: Corman, Tosama Develop Biodegradable Plastic Tampon Applicator, Trevira Changes Name
    Suominen Appoints SVP, Transformation Management Office
    Minnesota Signs PFAS Ban in Consumer Products
    Orthopedic Design & Technology

    Latest Breaking News From Orthopedic Design & Technology

    AlloSource Launches AlloMend Duo Acellular Dermal Matrix
    TendoNova Inks Partnership With AcCELLerated Biologics
    Stryker Achieves First Surgeries Using Q Guidance System with Cranial Guidance Software
    Printed Electronics Now

    Latest Breaking News From Printed Electronics Now

    Partner Workshops Start Solliance 2.0
    Weekly Recap: Smart Skis, Universal Display Top This Week’s Stories
    Wiliot Appoints Antony Yousefian as VP of Climate & Circularity

    Copyright © 2023 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login