The aim of the JPCA Show is “to contribute to the advancement of the electronic circuit industry and all related fields by presenting an exhibition of products, knowledge and solutions related to the electronic circuits and packaging technologies used in all electronic devices, IT devices and equipment, as well as the design, testing and logistics of large electronics (printed electronics, stretchable electronics, etc.).”
At this year’s JPCA, the company will spotlight its latest electronics-related materials based on the Group’s materials and processing technologies, and propose solutions to meet the electronic engineering needs of its customers and end-users. Visitors to the Toyochem booth can expect to learn more about the LIOELM TSS series of electromagnetic shielding films, which are specially designed to meet strict shielding demands. The TSS310 type responds to customer calls for thinner-type films, while the TSS500 blocks high-frequency interference.
The company will have on display LIOELM TSC200 electrically conductive adhesive sheets, which exhibit high humidity resistance suitable for mounting electronic components, and high shielding properties. Used as a method to conduct heat from electronic components, the LIOELM TSU700 thermally conductive sheets will also be featured at the booth.
In addition, Toyochem will showcase its lineup of products for electronic applications including high heat resistant nano-bonding agents, low dielectric products, EMC protective tapes, component-mounting protective tapes, high heat resistant polyimide PCB protecting tapes, LIOELM LE501 heat resistant carrier tapes for FPCs, R310 heat resistant component fixing/holding tapes and more.