“With a strong patented product portfolio and customer relationships, the acquisition of Dynaloy exemplifies Versum’s strategy to enhance its SP&C (Surface Prep & Clean) technology capabilities and product offerings to the growing advanced packaging materials market in the semiconductor industry,” said Edward Shober, SVP, Materials.
Versum Materials’ SP&C technologies are used to selectively etch and remove residue and contamination during multiple steps of the integrated circuit fabrication process. After closing, Dynaloy’s business will be integrated into Versum’s portfolio of SP&C formulated product offerings and will strengthen and accelerate its growth in Advanced Packaging.
The transaction is expected to close during the fiscal fourth quarter 2017. It will be funded from cash on hand.