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    Breaking News

    NXP Powers Event Passes for 150,000 at the International 29th Summer Universiade

    MIFARE Ultralight Nano contactless entrance passes provide convenient experience for secure access to sports venues.

    Related CONTENT
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    • Applied Materials Names Dan Durn as Next CFO
    • NXP Announces Production of Security Chips in the US
    08.18.17
    NXP Semiconductors N.V. is the official supplier of the smart ticketing solution for the 29th Summer Universiade in Taipei, one the world’s top international sporting events, where university student athletes from all over the world compete in 17 categories.

    NXP’s MIFARE Ultralight Nano, a contactless smart paper ticketing IC, is powering the technology used in the entrance passes for the 150,000 athletes, government officials, university leaders, VIP guests, delegates and other event participants from all over the world. The solution is in the form of an ID badge that will provide authorized access to the sports venues, training centers, athlete residences, meal programs and VIP events such as the opening and closing ceremonies.

    NXP collaborated with the Taipei City Government and the Universiade Committee to develop the MIFARE Ultralight Nano smart ticketing solution.

    “2017 Taipei Summer Universiade is the biggest international sports event hosted by Taiwan,” Li-Chong Su, the chief of Taipei Summer Universiade Committee, said. “In order to ensure the security of every participant, including athletes, judges and VIP guests, flow control is critical. With their advanced technology, the complex identity verification process turns out to be faster, more convenient and more secure for all participants.”

    The 29th Summer Universiade in Taipei is taking place in Taipei, Taiwan, from Aug. 19-30, 2017.
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    Related Breaking News

    • Breaking News | Financial News | Semiconductors and Quantum Dots | Sensors and Wearables

      NXP Semiconductors Reports 2Q 2017 Results

      Reported revenue of $2.202 billion, GAAP gross margin of 49.2%.
      08.04.17

    • Breaking News | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables

      NXP, Amazon Web Services Launch Cooperation in IoT

      Provides support for edge computing and IoT Cloud.
      07.31.17

    • Breaking News | Personnel | Semiconductors and Quantum Dots | Sensors and Wearables

      NXP Announces Executive Management Transition

      Peter Kelly will return to the role of EVP and CFO, which he held for more than three years.
      07.24.17


    • Breaking News | Manufacturing | Personnel | Semiconductors and Quantum Dots
      Applied Materials Names Dan Durn as Next CFO

      Applied Materials Names Dan Durn as Next CFO

      Current NXP Semiconductors N.V. CFO will join Applied Materials in August.
      07.24.17

    • Breaking News | RFID and NFC | Sensors and Wearables

      NXP Announces Production of Security Chips in the US

      Multimillion-dollar expansion program will complete the re-shoring of an end-to-end US supply chain.
      07.21.17

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