The collaboration brings together Qualcomm Spectra technologies and expertise in computer vision architecture and algorithm with Himax’s technologies in wafer optics, sensing, driver, and module integration capabilities to deliver a fully integrated SLiMTM (Structured Light Module) 3D solution.
The SLiMTM is a turn-key 3D camera module that delivers real-time depth sensing and 3D point cloud generation with high resolution and high accuracy performance for indoor and outdoor environments. The SLiMTM is engineered for very low power consumption in a compact, low profile form factor. Qualcomm Technologies and Himax will commercialize the SLiMTM 3D camera as a total camera system solution for a wide array of markets and industries with mass production targeting in Q1/2018.
“As an engineer, it is gratifying to see how our technology inventions enable products that will enrich user experience for consumers around the world,” said Chienchung Chang, VP of engineering, Qualcomm Technologies, Inc. “It has been a great experience collaborating with Himax on the project to enable 3D computer vision technologies in smartphones, virtual reality and augmented reality products.”
“Our 3D sensing solution will be a game changing technology for smartphones, where we will enable the Android ecosystem to provide the next generation of mobile user experience,” said Jordan Wu, president and CEO of Himax Technologies.