09.18.17
Henkel Adhesive Technologies’ Electronics announced the introduction of two conformal coating metal inks for semiconductor package-level electromagnetic interference (EMI) shielding.
LOCTITE ABLESTIK EMI 8660S and LOCTITE ABLESTIK EMI 8880S offer flexibility in deployment and design, as they may be used with cost-effective spray coating equipment, while providing EMI shielding performance comparable to or better than capital-intensive, thin film metal deposition techniques. With adhesion to a variety of epoxy molding compounds, both materials enhance long-term reliability performance, the company reported.
“Henkel’s new conformal shielding inks enable the deposition of an ultra-thin, highly electrically conductive layer that provides the shielding effectiveness of pure metal, with greater production scalability at a fraction of the cost of other shielding methods,” said Jinu Choi, Henkel market segment head for emerging applications in semiconductor packaging materials. “Our solutions are distinctive, providing shielding effectiveness up to 80% higher than traditional organic-based conductive inks.”
Henkel’s package-level EMI shielding solutions include conformal coating metal inks for package surfaces and compartment shielding materials to isolate components within SiP devices. (Source: Henkel)
LOCTITE ABLESTIK EMI 8660S and LOCTITE ABLESTIK EMI 8880S offer flexibility in deployment and design, as they may be used with cost-effective spray coating equipment, while providing EMI shielding performance comparable to or better than capital-intensive, thin film metal deposition techniques. With adhesion to a variety of epoxy molding compounds, both materials enhance long-term reliability performance, the company reported.
“Henkel’s new conformal shielding inks enable the deposition of an ultra-thin, highly electrically conductive layer that provides the shielding effectiveness of pure metal, with greater production scalability at a fraction of the cost of other shielding methods,” said Jinu Choi, Henkel market segment head for emerging applications in semiconductor packaging materials. “Our solutions are distinctive, providing shielding effectiveness up to 80% higher than traditional organic-based conductive inks.”
Henkel’s package-level EMI shielding solutions include conformal coating metal inks for package surfaces and compartment shielding materials to isolate components within SiP devices. (Source: Henkel)
