With an optimized homogeneity and uniformity of the CIGS absorber layer, Solliance succeeded in manufacturing a fully interconnected mini module using back-end interconnect technology. This technology makes it possible to realize an interconnected CIGS-based device in one final processing step. The mini module (200 x 185 mm) contains 37 cells and has an aperture efficiency of 9.3% (average cell results of reference plates was 11.9%). The P3 scribe was made without shunting.
The back-end interconnect technology opens the way to free form and fully customizable CIGS modules.