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    Breaking News

    intelliPACK Off to Philadelphia for Pharmaceutical Packaging & Labeling Forum

    intelliFLEX’s Peter Kallai and Jones Packaging’s James Lee will discuss latest printed NFC chips, usage tracking and more.

    Related CONTENT
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    • Jones Healthcare Group Brings Expertise to Intelligent Packaging
    • University of Windsor, George Brown College Join intelliFLEX
    • Authentic or Not, Laipac Technologies, MBM Intellectual Property Law Join intelliFLEX
    • intelliFLEX Innovation Alliance Looks to Grow Canada’s Flexible Electronics Industry
    10.19.17
    The intelliFLEX Innovation Alliance and the intelliPACK Leadership Council will be speaking at one of the premiere packaging events in North America, hosted by the International Quality and Productivity Centre (IQPC).
     
    The 4th Annual Pharmaceutical Packaging and Labeling Forum, taking place Dec. 4-6, is a gathering of speakers and sponsors who will be sharing the most advanced techniques to meet rigorous regulations, deliver to a global market, and enhance patient safety. Speakers will address regulatory compliance, the implementation of end-to-end labeling, and the minimization of human error in production.
     
    Peter Kallai, president and CEO of intelliFLEX and co-founder of intelliPACK, along with James Lee, director of technology and Iinnovation at Jones Packaging and intelliPACK Leadership Council member, will speak about “Bringing Smart Packaging to Market: How Printable Electronics Add Value for Artwork, Packaging, and Labeling.”
     
    Attendees will learn how to lever recent advances in smart packaging technology, including the latest printed NFC chips, the delivery of sales information in the store, usage tracking at home, and prompt reordering when the product is empty, plus more.
     
    intelliFLEX secured a 20% discount for all intelliPACK members, contact Leo Valiquette or Kallai.
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    • nfc
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      Lux Research: 3D Printing Market to Reach $51 Billion in 2030

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