• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • Magazine
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Suppliers Guide
      • Add Your Company
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Breaking News

    SEMI-FlexTech Selects PARC to Build Ultra-Thin, Flexible Audio Speaker

    Technology may disrupt many industries, including packaging, wearables, music and medical.

    Related CONTENT
    • FLEX 2021 Opens Virtually with Sessions on FHE, Materials
    • Xerox Releases 4Q, Full Year Results
    • DARPA Awards PARC Contract to Expand Ocean Knowledge
    • PARC Selects AlphaSTAR’s GENOA 3DP for AM Simulation
    • CPES2018 Set for May 23-24, 2018 in Toronto
    10.31.17
    FlexTech, a SEMI Strategic Association Partner, announced a new development project with PARC, a Xerox company, to develop a hybrid, highly bendable, paper-like smart tag , incorporating a thin audio speaker. The product is aimed at applications in packaging , wearables prosthetics, soft robotics, smart tags, and smart cities and homes.
     
    PARC will use inkjet printing to build prototypes of the paper-like smart tags capable of producing audio signals, on a silver-printed polyethylene naphthalene (PEN) or polyimide (PI) substrate. They will develop and demonstrate a process for bonding chips, and printing active and passive components, as well as interconnects on the flexible substrate, essential in meeting the project goals for ruggedness and form factor.
     
    PARC will also focus on printing actuators to create thin film audio speakers. The technology will enable custom systems to be built on demand.
     
    “We are pleased to continue our collaboration with SEMI-FlexTech in a project which takes advantage of the wide range of expertise on the PARC staff,” said Bob Street, project technical lead at PARC. “This new project is technically challenging because it combines a number of novel technologies needed to achieve stringent requirements, including the capability for a thin, paper-like film to produce clear speech audio.  We are looking forward to the challenge and implications for commercial products.”
     
    In 2014, FlexTech awarded PARC with a project grant to develop printed sensors. Partly because of this work, it is now possible to print transistor circuits in a fully additive fashion, and to combine these with sensors, actuators and other electronic components.
     
    “We have had a long, fruitful relationship with PARC and look forward to excellent results from this project which clearly advances innovation in flexible, printable electronics, enabling solutions that lead to safer, healthier lives,” said Melissa Grupen-Shemansky, CTO at SEMI-FlexTech. “In addition to pushing the boundaries in electronics, PARC pays attention to manufacturability and affordability, ensuring developments are scalable from R&D to production.”
     
    PARC and SEMI-FlexTech staff envisage additive manufacturing delivering intelligence into electronics fabricated on demand, including smart packaging and wearable devices in conformal shapes. At the heart of this development are material science, novel printing technologies as well as process driven design that will deliver libraries of smart components and systems. The constituent “inks” of this technology are nanomaterials, molecular semiconductors, inorganic composites and silicon chiplets that together form circuits, sensors, light emitters, batteries, and more, integrated directly into products of all shapes, sizes and textures.
     
     
    Related Searches
    • PARC
    • a xerox company
    • circuits
    • semi
    Suggested For You
    FLEX 2021 Opens Virtually with Sessions on FHE, Materials FLEX 2021 Opens Virtually with Sessions on FHE, Materials
    Xerox Releases 4Q, Full Year Results Xerox Releases 4Q, Full Year Results
    DARPA Awards PARC Contract to Expand Ocean Knowledge DARPA Awards PARC Contract to Expand Ocean Knowledge
    PARC Selects AlphaSTAR’s GENOA 3DP for AM Simulation PARC Selects AlphaSTAR’s GENOA 3DP for AM Simulation
    CPES2018 Set for May 23-24, 2018 in Toronto CPES2018 Set for May 23-24, 2018 in Toronto
    SEMI | FlexTech SEMI | FlexTech
    Innovation Lab, Xerox, PARC to Develop Solutions for Health Care Innovation Lab, Xerox, PARC to Develop Solutions for Health Care
    FlexTech to Host FHE & Sensor Workshop for the Automotive Industry FlexTech to Host FHE & Sensor Workshop for the Automotive Industry
    FlexTech Hosts Workshop on FHE and Sensors in the Automotive Industry FlexTech Hosts Workshop on FHE and Sensors in the Automotive Industry
    PARC to Develop Explainable Artificial Intelligence Science for DARPA PARC to Develop Explainable Artificial Intelligence Science for DARPA
    DARPA Chooses PARC, Siemens, Georgia Institute of Technology, MSU to Transform Manufacturing DARPA Chooses PARC, Siemens, Georgia Institute of Technology, MSU to Transform Manufacturing
    Brewer Science Recognized with FLEXI Award Brewer Science Recognized with FLEXI Award
    NuCurrent Named 2017 FLEXI Awards Winner NuCurrent Named 2017 FLEXI Awards Winner
    Award Winners Announced at 2017FLEX Award Winners Announced at 2017FLEX
    2017FLEX Highlights Opportunities in Flexible Hybrid Electronics 2017FLEX Highlights Opportunities in Flexible Hybrid Electronics

    Related Online Exclusives

    • Conductive Inks and Coatings | Flexible and Printed Electronics | Graphene, Perovskites and Carbon Nanotubes | Manufacturers News | Manufacturing | Research Institutions | Sensors and Wearables | Suppliers News | Universities
      FLEX 2021 Opens Virtually with Sessions on FHE, Materials

      FLEX 2021 Opens Virtually with Sessions on FHE, Materials

      Keynote speakers, panelists focus on opportunities for flexible hybrid electronics, new materials.
      David Savastano, Editor 02.24.21

    • Breaking News | Financial News | Flexible and Printed Electronics | Research Institutions
      Xerox Releases 4Q, Full Year Results

      Xerox Releases 4Q, Full Year Results

      Company looks to stand up PARC, other businesses.
      01.28.21

    • Breaking News | Research Institutions | Sensors and Wearables
      DARPA Awards PARC Contract to Expand Ocean Knowledge

      DARPA Awards PARC Contract to Expand Ocean Knowledge

      Next phase in Ocean of Things project deploys sensors to collect data.
      Printed Electronics Now Staff 10.23.20


    • 3D Printing | Breaking News | Research Institutions
      PARC Selects AlphaSTAR’s GENOA 3DP for AM Simulation

      PARC Selects AlphaSTAR’s GENOA 3DP for AM Simulation

      Will be used on ARPA-E’s DIFFERENTIATE Program.
      Printed Electronics Now staff 10.21.20

    • Breaking News | Flexible and Printed Electronics | Research Institutions | Sensors and Wearables | Smart Cards and Packaging | Universities

      CPES2018 Set for May 23-24, 2018 in Toronto

      intelliFLEX re-signs top sponsors NovaCentrix, Xerox.
      10.26.17

    Breaking News
    • Weekly Recap: OPV’s Future, Graphene Flagship and Japan Display Top This Week’s Stories
    • SEMI Foundation Receives $1.5 Million Grant to Bolster Michigan’s Semiconductor Talent Pipeline
    • onsemi Recognized by Fortune 500 for Its Transformation Journey
    • LG Display Presents AI-Driven NFT Artwork on Transparent OLED
    • Joe Stockunas Joins SEMI as Americas President
    View Breaking News >
    CURRENT ISSUE

    Winter 2021

    • Printed Electronics Now’s International Suppliers’ Directory
    • The Automotive Market and Flexible and Printed Electronics
    • Flexible and Printed Electronics in Healthcare
    • Flexible and Printed Electronics Make Gains in Smart Packaging
    • PAPERONICS: Low-cost multisensory paper and packaging applications
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • About Us
    • Privacy Policy
    • Terms And Conditions
    • Contact Us

    follow us

    Subscribe
    Nutraceuticals World

    Latest Breaking News From Nutraceuticals World

    Thorne Relaunches Gut Health Test with Microbiome Wipe
    Alkemist Labs Announces Alkemist Assured Seal and Next Generation Transparency Reports
    GC Rieber Foundations Expand Philanthropic Efforts
    Coatings World

    Latest Breaking News From Coatings World

    Nippon Paint Automotive Americas Appoints Robert Angart CEO and President
    Sustainability, Economy are Focus of BCF’s Annual Conference
    Demand for Rhino Shield Increases
    Medical Product Outsourcing

    Latest Breaking News From Medical Product Outsourcing

    New Breast Implant Surgery Guidelines to Enhance Patient Safety
    Rhythm Management Group Debuts RhythmSynergy Tech Platform
    FDA Approves Trial Completion for Virtual Incision's MIRA Platform
    Contract Pharma

    Latest Breaking News From Contract Pharma

    iECURE Enters Agreement with Center for Breakthrough Medicines
    CPDC Enters Clinical Manufacturing Deal with CellBion
    Olon to Build New R&D Center in Italy
    Beauty Packaging

    Latest Breaking News From Beauty Packaging

    K-Beauty Brand Siita Shares Plastic Decomposition Technology with the Beauty Industry
    Shellworks Raises $6.2 Million in Seed Funding
    Ulta Beauty Reports Record First Quarter 2022 Results
    Happi

    Latest Breaking News From Happi

    Honeywell Addresses Critical Issues Such as Sustainability, Workforce Training and Digitalization
    Monat Global Wins Four Stevie Awards in the 20th Annual American Business Awards
    Coty Expands Vegan Beauty Portfolio With New Rimmel Mascara
    Ink World

    Latest Breaking News From Ink World

    Orion to Finish Gas Black Expansion in Germany by Early 2023
    Richard Childress Racing Shows Off New Wraps for 2022 NASCAR Season
    ProAmpac Acquires Specialty Packaging, Inc.
    Label & Narrow Web

    Latest Breaking News From Label & Narrow Web

    UPM Raflatac accelerates label growth with acquisition
    Labelexpo Asia 2022 postponed
    Teklynx software helps Top Clean Injection validate labels
    Nonwovens Industry

    Latest Breaking News From Nonwovens Industry

    Rael Raises $35M in Series B Funding
    Schobertechnologies Offers Rotary Web-fed Converting Solutions
    Thorne Relaunches Gut Health Test with Microbiome Wipe
    Orthopedic Design & Technology

    Latest Breaking News From Orthopedic Design & Technology

    Toetal Solutions Raises $1.02 Million in New Financing
    ManaMed's ManaSport Wearable Ultrasound Earns FDA Nod
    Ekso Bionics Names Jerome Wong as Interim CFO
    Printed Electronics Now

    Latest Breaking News From Printed Electronics Now

    SEMI Foundation Receives $1.5 Million Grant to Bolster Michigan’s Semiconductor Talent Pipeline
    onsemi Recognized by Fortune 500 for Its Transformation Journey
    LG Display Presents AI-Driven NFT Artwork on Transparent OLED

    Copyright © 2022 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login