• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • Magazine
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Suppliers Guide
      • Add Your Company
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Breaking News

    Samsung Electronics, Qualcomm Expand Foundry Cooperation on EUV Process Technology

    Qualcomm anticipates its future Snapdragon 5G mobile chipsets will use Samsung’s 7nm LPP EUV process technology.

    Related CONTENT
    • CTA: Automotive Tracking for Record Growth at CES 2022
    • CTA Announces Return to Las Vegas for CES 2022
    • STMicroelectronics, Qualcomm Technologies Collaborate
    • Qualcomm Board of Directors Unanimously Rejects Revised Broadcom Proposal
    • NXP Semiconductors Reports 4Q, Full Year 2017 Results
    02.26.18
    Samsung Electronics Co., Ltd. and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, announced their intention to expand their decade-long foundry relationship into EUV (extreme ultra violet) lithography process technology, including the manufacture of future Qualcomm Snapdragon 5G mobile chipsets using Samsung’s 7-nanometer (nm) LPP (Low Power Plus) EUV process technology.
     
    Using 7LPP EUV process technology, Snapdragon 5G mobile chipsets will offer a smaller chip footprint, giving OEMs more usable space inside upcoming products to support larger batteries or slimmer designs. Process improvements, combined with a more advanced chip design, are expected to bring significant improvements in battery life.
     
    Last May, Samsung introduced 7LPP EUV, its first semiconductor process technology to use an EUV lithography solution. It is anticipated that EUV lithography deployment will break the barriers of Moore’s law scaling, paving the way for single nanometer semiconductor technology generations.
     
    Compared to its 10nm FinFET predecessors, Samsung’s 7LPP EUV technology not only greatly reduces the process complexity with less process steps and better yield, but also allows up to a 40% increase in area efficiency with 10% higher performance or up to 35% lower power consumption.
     
    “We are excited to lead the 5G mobile industry together with Samsung,” said RK Chunduru, SVP, supply chain and procurement, Qualcomm Technologies, Inc.
    Related Searches
    • inc
    • samsung
    • batteries
    • electronics
    Suggested For You
    CTA: Automotive Tracking for Record Growth at CES 2022 CTA: Automotive Tracking for Record Growth at CES 2022
    CTA Announces Return to Las Vegas for CES 2022 CTA Announces Return to Las Vegas for CES 2022
    STMicroelectronics, Qualcomm Technologies Collaborate STMicroelectronics, Qualcomm Technologies Collaborate
    Qualcomm Board of Directors Unanimously Rejects Revised Broadcom Proposal Qualcomm Board of Directors Unanimously Rejects Revised Broadcom Proposal
    NXP Semiconductors Reports 4Q, Full Year 2017 Results NXP Semiconductors Reports 4Q, Full Year 2017 Results
    Qualcomm, USI to Form JV for Semiconductor Module Factory in Brazil Qualcomm, USI to Form JV for Semiconductor Module Factory in Brazil
    Qualcomm Confirms Receipt of Revised Proposal from Broadcom Qualcomm Confirms Receipt of Revised Proposal from Broadcom
    Qualcomm Receives Authorization from EC, KFTC for NXP Semiconductors Acquisition Qualcomm Receives Authorization from EC, KFTC for NXP Semiconductors Acquisition
    Cristiano R. Amon Named President of Qualcomm Cristiano R. Amon Named President of Qualcomm
    Qualcomm Board Rejects Director Nominees Assembled by Broadcom and Silver Lake Partners Qualcomm Board Rejects Director Nominees Assembled by Broadcom and Silver Lake Partners
    Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
    Internet of Things Technology Market Estimated at $639.74 Billion by 2022 Internet of Things Technology Market Estimated at $639.74 Billion by 2022
    Himax Technologies Reports 3Q 2017 Financial Results Himax Technologies Reports 3Q 2017 Financial Results
    HP Completes Acquisition of Samsung Electronics Co., Ltd. Printer Business HP Completes Acquisition of Samsung Electronics Co., Ltd. Printer Business
    NXP Semiconductors Reports 3Q 2017 Results NXP Semiconductors Reports 3Q 2017 Results

    Related Breaking News

    • Breaking News | Displays and Lighting | Flexible and Printed Electronics | Manufacturers News | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Sensors and Wearables | Suppliers News | Touch Screens
      CTA: Automotive Tracking for Record Growth at CES 2022

      CTA: Automotive Tracking for Record Growth at CES 2022

      More than 175 companies have committed from the transportation and vehicle technology industry for 2022, which is a 12% increase from CES 2020.
      05.24.21

    • Breaking News | Displays and Lighting | Flexible and Printed Electronics | Manufacturers News | Photovoltaics | Sensors and Wearables | Suppliers News
      CTA Announces Return to Las Vegas for CES 2022

      CTA Announces Return to Las Vegas for CES 2022

      CES will convene the tech industry in person and digitally.
      04.28.21

    • Breaking News | Semiconductors and Quantum Dots | Sensors and Wearables
      STMicroelectronics, Qualcomm Technologies Collaborate

      STMicroelectronics, Qualcomm Technologies Collaborate

      Working on unique sensor solutions for next-gen mobile, connected PC, IoT, and wearable applications.
      Printed Electronics Now staff 11.10.20


    • Breaking News | Mergers and Acquisitions | Semiconductors and Quantum Dots
      Qualcomm Board of Directors Unanimously Rejects Revised Broadcom Proposal

      Qualcomm Board of Directors Unanimously Rejects Revised Broadcom Proposal

      Offers to meet to see if Broadcom can address serious deficiencies in value and certainty.
      02.12.18

    • Breaking News | Financial News | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables

      NXP Semiconductors Reports 4Q, Full Year 2017 Results

      Full year revenue was $9.26 billion, a decline of approximately 3% year on year.
      02.09.18

    Breaking News
    • ams OSRAM Introduces New Horticulture LEDs
    • Avery Dennison Launches AD Twist U7XM Inlays
    • ARPA-E Funding Drives Innovation, Industry Partnerships at NREL
    • InnovationLab Acquires Flexible Printed Battery Technology from Evonik
    • Canatu Receives IATF 16949:2016 Certification
    View Breaking News >
    CURRENT ISSUE

    Winter 2021

    • Printed Electronics Now’s International Suppliers’ Directory
    • The Automotive Market and Flexible and Printed Electronics
    • Flexible and Printed Electronics in Healthcare
    • Flexible and Printed Electronics Make Gains in Smart Packaging
    • PAPERONICS: Low-cost multisensory paper and packaging applications
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • About Us
    • Privacy Policy
    • Terms And Conditions
    • Contact Us

    follow us

    Subscribe
    Nutraceuticals World

    Latest Breaking News From Nutraceuticals World

    Thorne Relaunches Gut Health Test with Microbiome Wipe
    Alkemist Labs Announces Alkemist Assured Seal and Next Generation Transparency Reports
    GC Rieber Foundations Expand Philanthropic Efforts
    Coatings World

    Latest Breaking News From Coatings World

    ICP Receives ASC Innovation Award for Spray Foam That Meets Changing Environmental Regulations
    Pylon Coatings Uses Polygiene Biomaster & Verimaster for Antimicrobial Surface Protection
    Sto Corp. Recognized with Multiple Honors at the EIFS Hero Awards
    Medical Product Outsourcing

    Latest Breaking News From Medical Product Outsourcing

    Medtronic, DaVita to Create New Kidney Care Firm
    OmniGuide's RevoLix HTL Hybrid Thulium Laser OK'ed for BPH and Stone Treatments
    In Vitro Diagnostic Medical Devices Regulation Takes Effect
    Contract Pharma

    Latest Breaking News From Contract Pharma

    DFE Pharma Opens India CoE for Fast-Track Formulation Services
    Helsinn Establishes New R&D Hub in the U.S.
    CureVac, myNEO Partner on Antigen Targets for mRNA-Cancer Vax Development
    Beauty Packaging

    Latest Breaking News From Beauty Packaging

    Carlyle To Acquire HCP Packaging
    Estée Lauder Companies Faces Class Action Lawsuit
    La Roche-Posay Launches Matte Moisturizer for Oily Skin
    Happi

    Latest Breaking News From Happi

    Women in Flavor and Fragrance Present 2022 Recognition Awards Dinner June 16
    Univar Expands Distribution Agreement with ANGUS Chemical Company
    Acme-Hardesty Passes Responsible Distribution Verification
    Ink World

    Latest Breaking News From Ink World

    NAPIM’s Virtual Digital & Emerging Technologies Conference is Back, June 14–15, 2022
    CEMATEX Introduces Online Business Platform to Connect Global Textile Community
    PICO Chemical Celebrates 46 Years
    Label & Narrow Web

    Latest Breaking News From Label & Narrow Web

    Teklynx software helps Top Clean Injection validate labels
    Zeller+Gmelin named Berry Global’s 2021 Ink Supplier of the Year
    Videojet and Loftware partner to accelerate labeling automation
    Nonwovens Industry

    Latest Breaking News From Nonwovens Industry

    Rael Raises $35M in Series B Funding
    Schobertechnologies Offers Rotary Web-fed Converting Solutions
    Thorne Relaunches Gut Health Test with Microbiome Wipe
    Orthopedic Design & Technology

    Latest Breaking News From Orthopedic Design & Technology

    ManaMed's ManaSport Wearable Ultrasound Earns FDA Nod
    Ekso Bionics Names Jerome Wong as Interim CFO
    Exactech Completes First Surgeries Using Next-Gen Cage Glenoid
    Printed Electronics Now

    Latest Breaking News From Printed Electronics Now

    ams OSRAM Introduces New Horticulture LEDs
    Avery Dennison Launches AD Twist U7XM Inlays
    ARPA-E Funding Drives Innovation, Industry Partnerships at NREL

    Copyright © 2022 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login