This nine-months long project will seek out and identify current companies and research groups involved in flexible and printed electronics. Data compiled from the research on the processing technologies and performance targets for functional components will serve as a three-year, five-year and 10-year horizon for benchmarking.
The project came to fruition in response to a lack of comprehensive benchmark studies on the current state of printed electronics assessing functional block performance such as flexible batteries, high performance circuits, speaker and audio circuits, antenna, sensors of all types and more.
During this investigation period, the Cal Poly project team will be contacting targeted leaders in printed and flexible hybrid electronics (FHE) for their participation. A free executive summary of the benchmark is provided to the participants and the completed report will be available for purchase at a later time. The study will conclude with a TRL/MRL assessment for each printed electronics functional block.
For those interested in contributing to this benchmark study, please review the contact instructions below, fill out this survey or call (805) 756-2540 for more information. Interested people can read more here.
To participate, please contact the following based on corresponding areas of interest:
Dr. John Pan at firstname.lastname@example.org
• Integration Technologies
• Testing Technologies
Dr. Malcolm Keif at email@example.com
• High Performance Circuits
Dr. Xiaoying Rong at firstname.lastname@example.org
• Graphics with Embedding Electronics
Marc Chason at email@example.com
• Energy Harvesting
• Audio Speakers