03.07.18
Meyer Burger Technology Ltd announced that it has successfully concluded strategically important contracts with two existing customers in Asia for the delivery of its high precision industrial DW 288 Sapphire cutting platform for slicing and wafering applications in specialised non-PV technologies.
The total contractual value of both orders is approximately CHF 14 million ($15 million). The orders comprise installation, on-site training and service of the industry-leading DW 288 Sapphire cutting platform. Delivery of the system solutions is scheduled for the second quarter 2018.
The total contractual value of both orders is approximately CHF 14 million ($15 million). The orders comprise installation, on-site training and service of the industry-leading DW 288 Sapphire cutting platform. Delivery of the system solutions is scheduled for the second quarter 2018.
