03.15.18
Brewer Science, Inc. announced its participation in SEMICON China 2018, March 14-16, 2018 at the Shanghai New International Expo Centre. As China endeavors to build its local semiconductor manufacturing infrastructure, Brewer Science is well positioned to support the region as a materials supplier.
Brewer Science will showcase its offerings in both wafer-level packaging and front-end lithography materials, along with longtime industry partner Nissan Chemical. Additionally, at the China Semiconductor Technology and International Conference (CSTIC) being held in conjunction with SEMICON China, Brewer Science’s Dr. Dongshun Bai will present at the packaging and assembly symposium, while the company’s Dr. Zhimin Zhu will speak at the lithography and patterning symposium.
China has seen rapid expansion over the last few years as its government works to correct the imbalance created by being the world’s largest electronics manufacturing market, while having to import most of its semiconductor devices. According to SEMI market reports, in 2016, China’s fabless companies doubled from 736 to over 1,300. From 2015 to 2018, new fab projects beginning production in China have outpaced other regions, causing a 3X increase in front-end fab equipment sales. As a result, China has moved into second place in worldwide fab equipment spending.
“China’s semiconductor industry is reaching a pivotal point in its history, as it sets a course to become competitive in both front- and back-end manufacturing,” said Kim Arnold, executive director Advanced Packaging Business Unit, Brewer Science. “We look forward to partnering with the local semiconductor supply chain by supporting advanced process and materials development.”
Brewer Science’s advanced packaging solutions include temporary bond/debond materials, redistribution layer (RDL)-first FOWLP build-up layer materials, and temporary base protection layers. The company looks forward to working closely with its Chinese customers to help them realize better packaging capabilities.
Brewer Science’s R&D investments in advanced lithography have resulted in materials solution sets that include multilayer, extreme ultraviolet, directed self-assembly and planarization materials.
Brewer Science will showcase its offerings in both wafer-level packaging and front-end lithography materials, along with longtime industry partner Nissan Chemical. Additionally, at the China Semiconductor Technology and International Conference (CSTIC) being held in conjunction with SEMICON China, Brewer Science’s Dr. Dongshun Bai will present at the packaging and assembly symposium, while the company’s Dr. Zhimin Zhu will speak at the lithography and patterning symposium.
China has seen rapid expansion over the last few years as its government works to correct the imbalance created by being the world’s largest electronics manufacturing market, while having to import most of its semiconductor devices. According to SEMI market reports, in 2016, China’s fabless companies doubled from 736 to over 1,300. From 2015 to 2018, new fab projects beginning production in China have outpaced other regions, causing a 3X increase in front-end fab equipment sales. As a result, China has moved into second place in worldwide fab equipment spending.
“China’s semiconductor industry is reaching a pivotal point in its history, as it sets a course to become competitive in both front- and back-end manufacturing,” said Kim Arnold, executive director Advanced Packaging Business Unit, Brewer Science. “We look forward to partnering with the local semiconductor supply chain by supporting advanced process and materials development.”
Brewer Science’s advanced packaging solutions include temporary bond/debond materials, redistribution layer (RDL)-first FOWLP build-up layer materials, and temporary base protection layers. The company looks forward to working closely with its Chinese customers to help them realize better packaging capabilities.
Brewer Science’s R&D investments in advanced lithography have resulted in materials solution sets that include multilayer, extreme ultraviolet, directed self-assembly and planarization materials.
