07.09.18
SCHOTT AG has entered into an agreement to acquire Primoceler Oy, a Finnish pioneer in glass micro bonding. The company’s hermetic packaging technology creates new possibilities for protection of sensitive electronics in medical implants, MEMS devices and other reliability-critical applications.
With this acquisition, SCHOTT enhances its core competence in the field of hermetic packaging. The transaction is expected to be completed before the end of 2018, subject to certain customary closing conditions. The parties have agreed to maintain confidentiality regarding the purchase price. Upon finalization of the acquisition, the company will conduct its business activities under the new name SCHOTT Primoceler Oy based in Tampere, Finland, as part of SCHOTT’s Electronic Packaging division.
SCHOTT’s Electronic Packaging division is among few companies worldwide offering a complete range of hermetic packaging technologies to protect sensitive electronics in automotive, aerospace, medical, and energy applications, among others. Hermetic packaging refers to the sealing of electrical contacts with glass or ceramics. These inorganic and virtually non-aging materials are used as insulators that prevent the intrusion of moisture and other contaminants.
The challenge lies in achieving a perfect bond between the electrical metal conductors and glass – a core competence SCHOTT has mastered over the course of many decades.
With the acquisition of Primoceler, SCHOTT’s hermetic packaging capabilities and product portfolio will expand substantially. Primoceler has developed a “glass-only” micro bonding method based on laser technology that can be completed without any heat or added materials. This innovative bonding process allows for the manufacture of vacuum-tight, ultra-miniature electronic or optical devices with superior reliability. Even electronics with extreme heat sensitivities can be safely encapsulated.
Glass micro bonding enables entirely new packaging concepts for devices that demand high reliability including medical implants, aerospace, automotive, optical devices, and micro-electro-mechanical systems (MEMS) for the Internet of Things .
“This new partnership with such a global leader positions us excellently to serve our customers around the world and scale up our production,” said Ville Hevonkorpi, CEO of Primoceler Oy.
“Electronics are entering more and more areas of our daily life,” said Peter Kniprath, head of SCHOTT’s Business Unit Electronic Packaging. “As a part of this, demands for safety and durability have increased. SCHOTT Primoceler Oy will focus on tackling these challenges and working with our customers towards completely new applications.”
With this acquisition, SCHOTT enhances its core competence in the field of hermetic packaging. The transaction is expected to be completed before the end of 2018, subject to certain customary closing conditions. The parties have agreed to maintain confidentiality regarding the purchase price. Upon finalization of the acquisition, the company will conduct its business activities under the new name SCHOTT Primoceler Oy based in Tampere, Finland, as part of SCHOTT’s Electronic Packaging division.
SCHOTT’s Electronic Packaging division is among few companies worldwide offering a complete range of hermetic packaging technologies to protect sensitive electronics in automotive, aerospace, medical, and energy applications, among others. Hermetic packaging refers to the sealing of electrical contacts with glass or ceramics. These inorganic and virtually non-aging materials are used as insulators that prevent the intrusion of moisture and other contaminants.
The challenge lies in achieving a perfect bond between the electrical metal conductors and glass – a core competence SCHOTT has mastered over the course of many decades.
With the acquisition of Primoceler, SCHOTT’s hermetic packaging capabilities and product portfolio will expand substantially. Primoceler has developed a “glass-only” micro bonding method based on laser technology that can be completed without any heat or added materials. This innovative bonding process allows for the manufacture of vacuum-tight, ultra-miniature electronic or optical devices with superior reliability. Even electronics with extreme heat sensitivities can be safely encapsulated.
Glass micro bonding enables entirely new packaging concepts for devices that demand high reliability including medical implants, aerospace, automotive, optical devices, and micro-electro-mechanical systems (MEMS) for the Internet of Things .
“This new partnership with such a global leader positions us excellently to serve our customers around the world and scale up our production,” said Ville Hevonkorpi, CEO of Primoceler Oy.
“Electronics are entering more and more areas of our daily life,” said Peter Kniprath, head of SCHOTT’s Business Unit Electronic Packaging. “As a part of this, demands for safety and durability have increased. SCHOTT Primoceler Oy will focus on tackling these challenges and working with our customers towards completely new applications.”
