01.08.19
Research Solution Insights reports that the flexible printed circuit board market will reach $33.39 billion by 2025.
Flexible printed circuits were originally designed as a replacement for traditional wire harnesses. From early applications during World War II to the present, growth and proliferation for flex circuits and flexible printed circuit boards continue exponentially. A flexible circuit in its purest form is a vast array of conductors bonded to a thin dielectric film.
This market is driven by the rising insistence of consumer electronics and application of these board in the automotive sector. However, the market may face confrontation because of the compelling nature of semiconductors and electronics industry in upcoming decades.
In 2016, the global market for flexible printed circuit boards stood at US$13.51 billion.
The market will reach $33.39 billion – growing at a CAGR of 11% – between 2017-2025, according to projections.
The categorization of the global market of flexible printed circuit (based on product type) is in -sided flex circuits, double-sided flex circuits, multi-layer flex circuits, and rigid-flex circuits. Further from these, sculpted flex circuits, single layered flexible circuits, and double access flexible circuits are also a major breed of flexible printed circuit boards available in this market. In terms of revenue, the multi-layer flex circuits segment led the market in 2016 and is expected to maintain its influence over the coming decades.
Apart from this, the rigid flex circuits segment is intended to offer most assuring growth opportunities to market players in the coming period, thanks to the rising demand for portable electronic devices in various economies, such as China, India, Japan, the U.K., the U.S., Germany, and Singapore.
Asia Pacific led the Geographical market with a share of 56% in 2016 and is likely to cling its position over the next few years. The increasing seepage of smart devices, abrupt evolution of industrial infrastructure that supports the assimilation of process automation, boosting adoption of sensors in automobiles, and escalating expenditures in communication technologies are driving the growth of the Asia Pacific market for flexible printed circuit boards. In addition to this, the rise in large scale investments in flexible printed circuit board manufacturing technology – Asia Pacific is a colossal hub for semiconductor manufacturers – is anticipated to boost this regional market in the near future.
Flexible printed circuits were originally designed as a replacement for traditional wire harnesses. From early applications during World War II to the present, growth and proliferation for flex circuits and flexible printed circuit boards continue exponentially. A flexible circuit in its purest form is a vast array of conductors bonded to a thin dielectric film.
This market is driven by the rising insistence of consumer electronics and application of these board in the automotive sector. However, the market may face confrontation because of the compelling nature of semiconductors and electronics industry in upcoming decades.
In 2016, the global market for flexible printed circuit boards stood at US$13.51 billion.
The market will reach $33.39 billion – growing at a CAGR of 11% – between 2017-2025, according to projections.
The categorization of the global market of flexible printed circuit (based on product type) is in -sided flex circuits, double-sided flex circuits, multi-layer flex circuits, and rigid-flex circuits. Further from these, sculpted flex circuits, single layered flexible circuits, and double access flexible circuits are also a major breed of flexible printed circuit boards available in this market. In terms of revenue, the multi-layer flex circuits segment led the market in 2016 and is expected to maintain its influence over the coming decades.
Apart from this, the rigid flex circuits segment is intended to offer most assuring growth opportunities to market players in the coming period, thanks to the rising demand for portable electronic devices in various economies, such as China, India, Japan, the U.K., the U.S., Germany, and Singapore.
Asia Pacific led the Geographical market with a share of 56% in 2016 and is likely to cling its position over the next few years. The increasing seepage of smart devices, abrupt evolution of industrial infrastructure that supports the assimilation of process automation, boosting adoption of sensors in automobiles, and escalating expenditures in communication technologies are driving the growth of the Asia Pacific market for flexible printed circuit boards. In addition to this, the rise in large scale investments in flexible printed circuit board manufacturing technology – Asia Pacific is a colossal hub for semiconductor manufacturers – is anticipated to boost this regional market in the near future.
