Harper Corporation of America
recently participated in the FLEX 2019 and MSTC event and was able to showcase its technology and products to professionals from throughout the flexible, hybrid, and printed electronics fields.
This year’s FLEX theme was "Electronics Out of the Box," while the theme for MSTC was "Sensor Systems Enabling Autonomous Mobility."
The event offered informational sessions, keynote speakers, and exhibits for participants to learn, discuss, and network with one another regarding the latest advancements in the industry.
Harper Corporation of America marked its 10th anniversary participating in the MSTC conference this year. The company hosted a booth exhibit and had personnel on hand to answer questions regarding the company’s advanced technology, products, and equipment.
The company discussed many of its offerings, including the QD Flatbed Ink Proofer and Multi-Process Printer. This system provides both direct and offset gravure printing capabilities and utilizes Harper’s XDI imaging engraving, allowing it to engrave almost anything that can be imaged in a TIF file. All of Harper’s cylinders are ceramic coated and laser engraved.
FLEX 2019 & MSTC was held Feb. 18-21, 2019, in Monterey, CA.