03.27.19
American Semiconductor, Inc. (ASI), the global leader in physically flexible integrated circuits called Semiconductor-on-Polymer (SoP), was awarded the 2019 FLEXI award for Product Innovation by FlexTech for ASI’s new FleX-NFC flexible NFC technology.
Tony Varghese of Boise State University’s Advanced Nanomaterials and Manufacturing Laboratory was also recognized as an outstanding early career researcher in flexible electronics with a third place poster award for his work on “Additive Manufacturing and Photonic Sintering of Flexible Thermoelectric Generators for Wearable Applications.”
“So much is happening in Boise during the first three months of 2019,” said Richard Ellinger, VP of sales and marketing at ASI. “ASI won this FLEXI, launched the world’s first ultra-thin and flexible Bluetooth chips, are adding FHE assembly in our facility, announced our Joint Development Agreement with HD MicroSystems to install on-shore production capacity for SoP CSP and FHE assembly at our Boise site, plus Mr. Tony Varghese, a doctoral candidate at Boise State University, received recognition at the FlexTech event. Sooner than we can all imagine, the world will start referring to Boise with a second nickname – the Flexible Valley, for all of the advanced work being done in flexible electronics right here.”
“Over the past five years, we have worked closely with American Semiconductor to build much-needed infrastructure in support of printed and flexible hybrid electronics research on campus," added Prof. David Estrada, Varghese’s research advisor at Boise State. "This has not only strengthened our partnerships with American Semiconductor, but is helping us advance research and applications of FHE systems with partners such as NASA, Air Force, and Boeing. Mr. Varghese’s efforts in thermoelectrics are just one example of the work Boise State students in the ANML are doing to bring new materials into FHE systems and applications.”
Tony Varghese of Boise State University’s Advanced Nanomaterials and Manufacturing Laboratory was also recognized as an outstanding early career researcher in flexible electronics with a third place poster award for his work on “Additive Manufacturing and Photonic Sintering of Flexible Thermoelectric Generators for Wearable Applications.”
“So much is happening in Boise during the first three months of 2019,” said Richard Ellinger, VP of sales and marketing at ASI. “ASI won this FLEXI, launched the world’s first ultra-thin and flexible Bluetooth chips, are adding FHE assembly in our facility, announced our Joint Development Agreement with HD MicroSystems to install on-shore production capacity for SoP CSP and FHE assembly at our Boise site, plus Mr. Tony Varghese, a doctoral candidate at Boise State University, received recognition at the FlexTech event. Sooner than we can all imagine, the world will start referring to Boise with a second nickname – the Flexible Valley, for all of the advanced work being done in flexible electronics right here.”
“Over the past five years, we have worked closely with American Semiconductor to build much-needed infrastructure in support of printed and flexible hybrid electronics research on campus," added Prof. David Estrada, Varghese’s research advisor at Boise State. "This has not only strengthened our partnerships with American Semiconductor, but is helping us advance research and applications of FHE systems with partners such as NASA, Air Force, and Boeing. Mr. Varghese’s efforts in thermoelectrics are just one example of the work Boise State students in the ANML are doing to bring new materials into FHE systems and applications.”
