03.28.19
Impinj, Inc. introduced new endpoint IC technologies to meet the increasing demand for item connectivity in the retail, grocery, consumer packaged goods and logistics markets.
Developed in an advanced semiconductor process node, these technologies paint the future of RAIN RFID by endowing Impinj endpoint ICs with differentiated features and enhanced performance, enabling these and other emerging markets in the coming months and years.
Impinj’s pioneering IC technologies improve readability and add new features and functionality to:
The new Impinj M700 series of endpoint ICs leverage these innovative IC technologies to enable 300 mm silicon wafers with more than twice as many ICs per wafer as any other RAIN RFID manufacturer’s 300 mm wafers, and more than four times as many as any using 200 mm wafers. Impinj M700 series ICs are so small that approximately 30 million of them will fit in a single coffee cup.
The Impinj M700 series of endpoint ICs enhances the Impinj platform, comprising RAIN RFID endpoints, connectivity and software. Organizations around the world use the Impinj platform to connect items to applications, enabling the Internet of Things. Impinj endpoint ICs have already enabled connectivity for more than 30 billion everyday items – including retail apparel, airline luggage, manufacturing equipment, and logistics items – allowing businesses to make smarter decisions, improve customer experience and drive sales.
Impinj will demonstrate the first chips in the Impinj M700 series to select partners and customers at RFID Journal Live from April 2-4, 2019.
Developed in an advanced semiconductor process node, these technologies paint the future of RAIN RFID by endowing Impinj endpoint ICs with differentiated features and enhanced performance, enabling these and other emerging markets in the coming months and years.
Impinj’s pioneering IC technologies improve readability and add new features and functionality to:
- Increase the distance, reliability, and speed at which a RAIN RFID system can inventory, locate and engage items;
- Enable key RAIN RFID use cases like item authentication, loss prevention, frictionless point-of-sale and shipment verification;
- Allow Impinj’s inlay partners to design smaller, high-performing, truly global RAIN RFID tags.
The new Impinj M700 series of endpoint ICs leverage these innovative IC technologies to enable 300 mm silicon wafers with more than twice as many ICs per wafer as any other RAIN RFID manufacturer’s 300 mm wafers, and more than four times as many as any using 200 mm wafers. Impinj M700 series ICs are so small that approximately 30 million of them will fit in a single coffee cup.
The Impinj M700 series of endpoint ICs enhances the Impinj platform, comprising RAIN RFID endpoints, connectivity and software. Organizations around the world use the Impinj platform to connect items to applications, enabling the Internet of Things. Impinj endpoint ICs have already enabled connectivity for more than 30 billion everyday items – including retail apparel, airline luggage, manufacturing equipment, and logistics items – allowing businesses to make smarter decisions, improve customer experience and drive sales.
Impinj will demonstrate the first chips in the Impinj M700 series to select partners and customers at RFID Journal Live from April 2-4, 2019.
