At this year's show, the company will spotlight its latest advances in electronics-related materials based on the group's materials and processing technologies, and propose solutions to meet the advanced performance needs of next-generation electronics designers.
Visitors to the Toyochem booth West Hall 3, Booth 168 can learn more about the LIOELM TSS series of electromagnetic interference (EMI) shielding films for flexible printed circuit (FPC) boards and other electronic components. The LIOELM TSS series features a two-layer design based on a flexible, heat-resistant resin that was developed in-house by Toyochem.
The LIOELM TSC 200 series of conductive adhesive sheets from Toyochem exhibit high moisture and heat resistance for the mounting of electronic components and provides high shielding performance. TSC 200’s conductive filler is dispersed into the heat-resistant adhesive resin, resulting in stable, low resistance and conductivity.
Also on display at the Toyochem booth will be the LIOELM TSS 500 series of EMI shielding films for next-generation high-speed transmission FPCs and the LIOELM TSU 500 series of low dielectric adhesive sheets for high-frequency circuits (antennas) found in 5G communication systems. Toyochem will also feature low-frequency electromagnetic wave absorbing sheets and urethane protective tapes.
In addition, Toyochem’s sister subsidiary Toyo Ink Co., Ltd. will be spotlighting the REXALPHA series of conductive silver pastes for ultra fine-line printing.