06.11.19
Micron Technology, Inc. introduced its new UFS 2.1 managed NAND products for automotive applications. The new portfolio addresses the need for fast system startup and higher data bandwidth for in-vehicle infotainment systems and instrument clusters to enhance the driver experience.
Next-generation infotainment systems include multiple high-resolution displays as well as artificial intelligence-enabled human-machine interface functionality such as voice, gesture and image recognition. These feature-rich and advanced performance systems require high-density, high-throughput and low-latency storage. Micron’s UFS 2.1 products deliver up to three times the sequential read performance of the company’s e.MMC-based products, bringing instant-on capability and improved responsiveness to create an immersive cabin experience in connected vehicles, the company reported.
“Automotive partners are demanding high-value memory solutions that deliver better performance at affordable price points, in addition to quality, reliability to operate in stringent automotive environments and supply longevity,” said Aravind Ramamoorthy, senior director of NAND solutions for Micron’s Embedded Business Unit. “Micron’s UFS 2.1 portfolio based on automotive-grade 64-layer 3D TLC NAND demonstrates our continued commitment to meet the requirements of emerging automotive applications with cost-effective solutions.”
Next-generation infotainment systems include multiple high-resolution displays as well as artificial intelligence-enabled human-machine interface functionality such as voice, gesture and image recognition. These feature-rich and advanced performance systems require high-density, high-throughput and low-latency storage. Micron’s UFS 2.1 products deliver up to three times the sequential read performance of the company’s e.MMC-based products, bringing instant-on capability and improved responsiveness to create an immersive cabin experience in connected vehicles, the company reported.
“Automotive partners are demanding high-value memory solutions that deliver better performance at affordable price points, in addition to quality, reliability to operate in stringent automotive environments and supply longevity,” said Aravind Ramamoorthy, senior director of NAND solutions for Micron’s Embedded Business Unit. “Micron’s UFS 2.1 portfolio based on automotive-grade 64-layer 3D TLC NAND demonstrates our continued commitment to meet the requirements of emerging automotive applications with cost-effective solutions.”