10.14.19
CPI announced that an event will take place Oct. 22-23, 2019, to showcase the outcomes of project Necomada (Nano-Enabled Conducting Materials Accelerating Device Applicability).
This project focused on lowering the cost of future IoT devices through the development of new conductive inks and flexible adhesives that improve the effectiveness, productivity and speed of printed electronics manufacturing. The event will provide hands-on experience to end-users of the technology and allow them to gain a better understanding of the technology’s applications in their markets.
IoT describes the connectivity of everyday devices to the internet – including vehicles, clothes and home appliances. The IoT market is estimated to be worth up to £10 trillion ($12.58 trillion) by 2025, presenting an enormous commercial opportunity for innovative companies. However, in many cases these devices must be integrated with flexible electronics, and existing production lines use highly expensive materials. For the IoT market to reach its full potential, low-cost solutions are needed for the mass production of flexible electronics.
The Horizon 2020 Necomada project, which involved a consortium of 13 industry partners, has improved market accessibility by developing conductive inks and flexible adhesives that enable high-speed roll-to-roll manufacture of flexible electronics. Partners in the consortium represented the entire value chain for printed electronics, from nanomaterial suppliers to end-users.
The consortium has also established a pilot line at CPI that integrates the materials, printing and component placement capabilities that are essential for high-volume device manufacture. This presents a reconfigurable open-access platform for companies to use when trialing their materials and flexible electronics products.
The free event will run over one and a half days and will be held at CPI’s National Formulation Centre in Sedgefield, UK.
Day 1 will feature presentations from Necomada’s industry partners, offering their perspectives on market trends and the benefits of IoT technology. There will also be presentations about the nanomaterial pilot line service developed as part of the Necomada project.
Interactive sessions on day 2 will give end-users hands-on experience with various aspects of CPI’s new capabilities, including manual screen printing, as well as mixing, depositing and testing a conductive screen ink.
The full event details and registration can be found here.
“The upcoming event is a fantastic opportunity to showcase the project’s outcomes to end-users, and we are excited to share details about the open-access pilot line service for high-volume manufacture of printed electronics," said Neville Slack, business development manager at CPI’s National Formulation Centre and coordinator of the Necomada project.
This project focused on lowering the cost of future IoT devices through the development of new conductive inks and flexible adhesives that improve the effectiveness, productivity and speed of printed electronics manufacturing. The event will provide hands-on experience to end-users of the technology and allow them to gain a better understanding of the technology’s applications in their markets.
IoT describes the connectivity of everyday devices to the internet – including vehicles, clothes and home appliances. The IoT market is estimated to be worth up to £10 trillion ($12.58 trillion) by 2025, presenting an enormous commercial opportunity for innovative companies. However, in many cases these devices must be integrated with flexible electronics, and existing production lines use highly expensive materials. For the IoT market to reach its full potential, low-cost solutions are needed for the mass production of flexible electronics.
The Horizon 2020 Necomada project, which involved a consortium of 13 industry partners, has improved market accessibility by developing conductive inks and flexible adhesives that enable high-speed roll-to-roll manufacture of flexible electronics. Partners in the consortium represented the entire value chain for printed electronics, from nanomaterial suppliers to end-users.
The consortium has also established a pilot line at CPI that integrates the materials, printing and component placement capabilities that are essential for high-volume device manufacture. This presents a reconfigurable open-access platform for companies to use when trialing their materials and flexible electronics products.
The free event will run over one and a half days and will be held at CPI’s National Formulation Centre in Sedgefield, UK.
Day 1 will feature presentations from Necomada’s industry partners, offering their perspectives on market trends and the benefits of IoT technology. There will also be presentations about the nanomaterial pilot line service developed as part of the Necomada project.
Interactive sessions on day 2 will give end-users hands-on experience with various aspects of CPI’s new capabilities, including manual screen printing, as well as mixing, depositing and testing a conductive screen ink.
The full event details and registration can be found here.
“The upcoming event is a fantastic opportunity to showcase the project’s outcomes to end-users, and we are excited to share details about the open-access pilot line service for high-volume manufacture of printed electronics," said Neville Slack, business development manager at CPI’s National Formulation Centre and coordinator of the Necomada project.
