01.07.20
Flex, in collaboration with QuickLogic Corporation and Infineon Technologies AG, an-nounced the availability of the FLEXino Sensor Fusion Development Kit to enable rapid prototyping and a corresponding 12mm x 12mm System-in-Package (SiP) for high volume production of Internet of Things (IoT) devices.
To help reduce time to market and scale production, the development kit and SiP enable a wide range of new and existing sensor fusion IoT products requiring audio, pressure and motion sensing, Bluetooth and WiFi capabilities. At the 2020 Consumer Electronics Show (CES), attendees interested in seeing a demonstration of the FLEXino Sensor Fusion De-velopment Kit can make an appointment to visit QuickLogic's suite or visit Infineon's booth.
“The FLEXino Sensor Fusion Development Kit and SiP are designed to help bring a variety of next-generation and existing IoT devices to market faster,” said Dave Gonsiorowski, VP, Innovation Services & Solutions at Flex. “A significant challenge with IoT design today is the availability of flexible integrated development kits that easily transition to high-volume manufacturing.”
To help reduce time to market and scale production, the development kit and SiP enable a wide range of new and existing sensor fusion IoT products requiring audio, pressure and motion sensing, Bluetooth and WiFi capabilities. At the 2020 Consumer Electronics Show (CES), attendees interested in seeing a demonstration of the FLEXino Sensor Fusion De-velopment Kit can make an appointment to visit QuickLogic's suite or visit Infineon's booth.
“The FLEXino Sensor Fusion Development Kit and SiP are designed to help bring a variety of next-generation and existing IoT devices to market faster,” said Dave Gonsiorowski, VP, Innovation Services & Solutions at Flex. “A significant challenge with IoT design today is the availability of flexible integrated development kits that easily transition to high-volume manufacturing.”
