SEMI FlexTech released a Request for Proposals (RFP) for advanced technology developments of flexible hybrid electronics (FHE) for sensors, power and other key electronic components.
Product demonstrations are required for award consideration.
The RFP topics include:
- Power and power integration;
- Electronics environmental sustainability;
- Advanced heterogeneous packaging for FHE;
- Materials advances;
- Soft robotics;
Review the full RFP for more information about the proposal submission process.
SEMI FlexTech’s Technical Council will evaluate, prioritize, review and manage the proposals and their resulting projects. Funding granted by SEMI FlexTech for the projects must be matched with funds in the form of cash and in-kind contributions from the grant recipient to cover total project costs. On average, the industry typically covers 60% of the funding for the development program.
“We invite proposals for leading-edge innovation,” said Melissa Grupen-Shemansky, executive director and CTO of SEMI FlexTech. “We look forward to fielding proposals that push the state-of-the-art of flexible and printed electronics to not only enable lighter and thinner electronics but advance device lifetime and robustness using environmentally sustainable processes and materials. FHE continues to transform electronics for industries including healthcare, transportation and communications.”
SEMI FlexTech will support technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals. Research and development efforts funded by SEMI FlexTech are in the U.S. government’s Technology Readiness Level (TRL) 3-6 and Manufacturing Readiness Level (MRL) 1-3 levels.
SEMI FlexTech anticipates announcing multiple awards to teams or U.S. organizations with research and development capabilities. White paper proposals are due July 10, 2020, at 5:00 p.m. PDT.