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    Breaking News

    Applied Materials Spotlights Sustainable AI at 50th Annual SEMICON West

    Keynotes and a panel presented by Applied Materials part of the virtual event.

    Applied Materials Spotlights Sustainable AI at 50th Annual SEMICON West
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    Printed Electronics Now staff07.09.20

    Big Data and AI are poised to transform virtually every industry. 

     

    Fueled by data from tens of billions of edge devices and emerging 5G networks , cloud computing and AI have the potential to generate new insights that can help address climate change and improve people’s lives.

     

    At the same time, there are questions about the environmental impact of digitalization, particularly the energy consumed by data centers and the computing resources needed to train powerful AI models. 

     

    Without improvements in technology, will Big Data and AI add to the world’s challenges? Or can digitalization bend the climate curve? What actions can the semiconductor and computing industry take to improve efficiency and consume fewer resources?

     

    Addressing these issues and more will be keynotes and a panel presented by Applied Materials at the 50th annual SEMICON West on July 21, which will be held in a virtual format this year.

     

    9:15 – 9:45 a.m. PT: Al Gore in conversation with Heather Clancy, editorial director of GreenBiz.com. Gore will share his thoughts on the global challenges our industry can help solve by driving advances in the latest cutting-edge technologies, especially by increasing the energy efficiency of semiconductors and computing.

     

    9:45 – 10:15 a.m. PT: Keynote by Applied Materials President and CEO, Gary Dickerson, who will highlight the need for sustainable AI and discuss actions that can be taken by companies throughout the semiconductor industry, both individually and collectively, to enable a better future.

     

    10:15 – 11:00 a.m. PT: Panel moderated by Dr. Eric Masanet, professor and Mellichamp chair of Sustainability Science for Emerging Technologies at UC Santa Barbara and a lead author of the UN’s Intergovernmental Panel on Climate Change (IPCC) Sixth Assessment Report.

    Dr. Masanet will lead a discussion entitled, “Bending the Climate Curve: Enabling Sustainable Growth of Big Data, AI and Cloud Computing,” featuring experts spanning the industry ecosystem, from Systems to Materials:

    • Dr. Rob Aitken, R&D fellow, Arm;
    • Dr. Samantha Alt, Cloud Solution architect, Intel;
    • Dr. Nicola Peill-Moelter, director of Sustainability Innovation, VMware;
    • Moe Tanabian, GM – Intelligent Devices, Microsoft;
    • Ellie Yieh, VP of Advanced Product Technology Development, Applied Materials;
    • Dr. Cliff Young, software engineer, Google

     

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      Applied Materials Develops New Technologies for Silicon Carbide Chipmakers

      Silicon carbide chips are transitioning to larger, 200mm wafers which boost output to meet growing global demand.
      09.09.21

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      Identiv Introduces uCreate NFC Mobile Application Platform and Software Development Kit

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      The all-in-one NFC mobile application platform makes it easy to develop, prototype, test, and successfully launch NFC-enabled applications.
      09.02.21

    • Breaking News | Financial News | Semiconductors and Quantum Dots
      Applied Materials Announces 3Q 2021 Results

      Applied Materials Announces 3Q 2021 Results

      Record quarterly revenue of $6.20 billion is up 41% year over year.
      08.23.21


    • Breaking News | Conductive Inks and Coatings | Displays and Lighting | Flexible and Printed Electronics | Manufacturers News | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Research Institutions | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Universities
      Techblick Articles Discuss Innovation Trends in Printed, Hybrid, In-Mold, 3D Electronics

      Techblick Articles Discuss Innovation Trends in Printed, Hybrid, In-Mold, 3D Electronics

      The goal is to demonstrate progress and state-of-the-art on various fronts.
      08.20.21

    • Breaking News | Mergers and Acquisitions | Semiconductors and Quantum Dots | Suppliers News
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      Becomes part of Electronics & Industrial's Interconnect Solutions business.
      07.01.21

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