04.27.22
FLEX Conference will gather industry experts July 11-14, 2022, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible and printed electronics .
The event will co-locate with SEMICON West Hybrid, North America’s premier microelec-tronics exhibition and conference that unites players across the entire electronics manu-facturing and design supply chain. Registration for both events is open.
Themed Electronics in Motion, FLEX Conference 2022 will focus on equipment, processes, materials and applications driving the latest flexible hybrid electronics (FHE) technology breakthroughs. The event will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.
“FLEX Conference has consistently helped turn great ideas into game-changing applica-tions for smart transportation, buildings and infrastructure; equipment sensorization; wearable and conformable medical devices; and more,” said Dr. Melissa Grupen-Shemansky, SEMI CTO and vice president of SEMI Technology Communities. “We are ex-cited to co-locate FLEX with SEMICON West Hybrid to advance the integration of tradition-al rigid electronics with flexible electronics to improve the way the world works and lives.”
Advances in sustainability across both industries will come into focus at the Global Sus-tainability Summit at SEMICON West Hybrid and FLEX as flexible electronics combine new levels of processing and sensing capability with improved power usage to make the devic-es more eco-friendly.
FLEX Conference 2022 Keynote will be presented by Dr. Michael D. McCreary, chief inno-vation officer, SVP, E Ink Corporation, who will discuss
“Electrophoretic Display Technology Will Change the Look of Automobiles, Transportation and Beyond.” More keynotes will be announced.
FLEX Conference 2022 Breakout Sessions will include:
• FHE Applications
• Flexible MedTech and Wearables
• Printing and Processing
• Reliability and Inspection
• Strategies and Sustainability
• Flexible Conductive Materials and Inks
• Flexible Power
• FHE Processing and Integration
The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West Hybrid 2022.
The event will co-locate with SEMICON West Hybrid, North America’s premier microelec-tronics exhibition and conference that unites players across the entire electronics manu-facturing and design supply chain. Registration for both events is open.
Themed Electronics in Motion, FLEX Conference 2022 will focus on equipment, processes, materials and applications driving the latest flexible hybrid electronics (FHE) technology breakthroughs. The event will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.
“FLEX Conference has consistently helped turn great ideas into game-changing applica-tions for smart transportation, buildings and infrastructure; equipment sensorization; wearable and conformable medical devices; and more,” said Dr. Melissa Grupen-Shemansky, SEMI CTO and vice president of SEMI Technology Communities. “We are ex-cited to co-locate FLEX with SEMICON West Hybrid to advance the integration of tradition-al rigid electronics with flexible electronics to improve the way the world works and lives.”
Advances in sustainability across both industries will come into focus at the Global Sus-tainability Summit at SEMICON West Hybrid and FLEX as flexible electronics combine new levels of processing and sensing capability with improved power usage to make the devic-es more eco-friendly.
FLEX Conference 2022 Keynote will be presented by Dr. Michael D. McCreary, chief inno-vation officer, SVP, E Ink Corporation, who will discuss
“Electrophoretic Display Technology Will Change the Look of Automobiles, Transportation and Beyond.” More keynotes will be announced.
FLEX Conference 2022 Breakout Sessions will include:
• FHE Applications
• Flexible MedTech and Wearables
• Printing and Processing
• Reliability and Inspection
• Strategies and Sustainability
• Flexible Conductive Materials and Inks
• Flexible Power
• FHE Processing and Integration
The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West Hybrid 2022.
