01.18.23
Can electronics manufacturing be reconfigured for our digital, environmentally-conscious age? IDTechEx's new report, "Manufacturing Printed Electronics 2023-2033," explores a wide range of manufacturing innovations that will enable additive, digital, and higher throughput electronics production across many length scales.
However, thus far, most R2R electronics manufacturing (RFID excepted) has largely remained confined to research centers and pilot lines. Some of the challenges associated with adopting R2R electronics manufacturing include establishing sufficient order volume, quality control, and component attachment. The report explores these issues and outlines emerging technological solutions such as high throughput digital printing, contactless in-line conductivity measurement, and photonic soldering.
Other emerging printing methods aim to bring additive digital manufacturing to length scales currently achieved with subtractive methods. Electrohydrodynamic (EHD) printing, in which traces as narrow as 1 um are produced using an electric field, is gradually gaining commercial traction for prototyping and repairs. Furthermore, multiple companies are developing multi-nozzle systems using MEMS (micro electromechanical systems) printheads to somewhat break the longstanding trade-off between throughput and viscosity.
Transition to R2R Manufacturing
Compatibility with rapid roll-to-roll (R2R) manufacturing is commonly cited as a key value proposition of printed/flexible electronics. Utilizing methods from conventional graphics printing, R2R manufacturing will enable cost-sensitive large-volume applications such as smart packaging and electronic skin patches. Furthermore, the high throughput of R2R electronics is ideally suited for producing large-area devices such as photovoltaic panels, lighting, and outdoor displays.However, thus far, most R2R electronics manufacturing (RFID excepted) has largely remained confined to research centers and pilot lines. Some of the challenges associated with adopting R2R electronics manufacturing include establishing sufficient order volume, quality control, and component attachment. The report explores these issues and outlines emerging technological solutions such as high throughput digital printing, contactless in-line conductivity measurement, and photonic soldering.
Digital Printing Methods
While R2R manufacturing typically utilizes conventional analog graphics printing methods (such as flexography), much of the innovation is within digital deposition methods that enable rapid prototyping and facilitate high mix low volume manufacturing (HMLV). Especially notable is laser-induced forward transfer (LIFT), which can be regarded as combining the benefits of inkjet, screen printing and direct laser structuring. This digital method can handle viscous inks, has a high throughput (being optically driven), and can even be used on non-planar surfaces since it's a non-contact method.Other emerging printing methods aim to bring additive digital manufacturing to length scales currently achieved with subtractive methods. Electrohydrodynamic (EHD) printing, in which traces as narrow as 1 um are produced using an electric field, is gradually gaining commercial traction for prototyping and repairs. Furthermore, multiple companies are developing multi-nozzle systems using MEMS (micro electromechanical systems) printheads to somewhat break the longstanding trade-off between throughput and viscosity.