IDTechEx provides a brief overview of the evolution of the technology to its current status and considers some of the latest technology trends.
Flexible and foldable high-performance barrier or encapsulation technology had long represented a technology challenge. The industry spent a decade and a half optimizing the approaches and the processes to achieve large-area production-grade results. The development, however, has not ended. Indeed, the commercial journey towards flexible and foldable devices is only just beginning. As such, the development of flexible barrier technologies still has far to travel.
Here, we provide a brief overview of the evolution of the technology to its current status and consider some of the latest technology trends that seek to replace current incumbent techniques. This overview is drawn from our report “Barrier Films and Thin Film Encapsulation for Flexible and/or Organic Electronics 2019-2029.” This report provides a detailed study of this technology space, examining the needs, analysing existing and emerging technology options, evaluating application requirements and mark
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