• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • Magazine
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Add Your Company
      • Suppliers Guide
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Live From Shows

    LOPEC 2017’s Technical, Scientific Conferences to Focus on New Technologies

    Leaders from Samsung, Johnson & Johnson, AU Optronics are among speakers on hand to offer their insights.

    Related CONTENT
    • Gemalto’s Secure Smart Chip to be Integrated in Samsung Galaxy S8 in Selected Markets
    • LOPEC 2017 Comes to Successful Conclusion
    • LOPEC 2017 Comes to Successful Conclusion
    • OE-A Honors Top Demonstrator Projects at LOPEC 2017
    • Growth of Flexible and Printed Electronics is Focus of LOPEC 2017
    David Savastano, Editor03.27.17
    The LOPEC 2017 Technical and Scientific Conferences are officially underway today, with a host of leaders from major companies scheduled to speak on topics throughout the printed electronics supply chain.
     
    The Plenary Session will begin with Wolfgang Mildner LOPEC general chair and founder and CEO of MSW, who will offer opening remarks.
     
    Henri Rajbenbach, project officer and senior expert, European Commission for Communications Networks, Content & Technology, will then discuss “EU Programs for Large Area Electronics: From Research to Innovation Funding.”  Rajbenbach will offer examples of funding and success stories, as well as anticipated results.
     
    Next up, Samsung SVP Dr. Sang Yoon Lee will discuss “Printed Electronics in Korea and Future Prospect of Organic Electronics.” Heliatek GmbH CEO Thibaud Le Séguillon will discuss “BiOPV – Building Integrated OPV.” 
     
    Concurrently, Dr. Constanze Ranfeld, OE-A’s project manager, will present “Introduction to Printed Electronics with Examples from Automotive.”
     
    LOPEC 2017 will then break into three series of four concurrent sessions, with two each from the Technical Conference and Scientific Conference.
     
    The Technical Conference features three pairs of concurrent sessions. The two morning sessions cover Energy and Functional Materials. The presenters during Energy include Dr. Martin Pfeiffer, Heliatek GmbH CTO; Prof. Dr. Pim Groen of Holst Centre; Jari Keskinen, project manager, Tampere University of Technology; and IN-CORE Systemes GM Dr. Michel Popovic.
     
    Functional Materials will be covered by Dr. Chun-Hao Tu, manager Advanced Device Research Center, AU Optronics; Inkron CEO Dr. Juha Rantala; Aurélie Morley, R&D lead, Merck Chemicals Ltd.; and Dr. Ryan Giedd, director, Device Engineering & Development, Brewer Science, Inc.
     
    The early afternoon Technical Conference sessions cover Touch, Tactile and Haptic Feedback and Biomedical Applications.  Speakers during Touch, Tactile and Haptic Feedback include Novasentis CEO Francois Jeanneau; Dr. Wolfgang Clemens, head of product management PolyTC, PolyIC GmbH & Co. KG;  and Bob Mackey, director of biometric architecture, Synaptics.  
     
    Biomedical Applications presenters include Dr. Steven Setford, director, Strip Development, Johnson & Johnson, Diabetes Care Companies; Dr. May Wheeler, scientist, Cambridge Display Technology Ltd.; and Giorgio Mutinati, scientist, AIT Austrian Institute of Technology.
     
    The final pair of Technical Conference sessions will cover Upscaling Production and Manufacturing Processes and Smart and Hybrid Systems
     
    Upscaling Production and Manufacturing Processes will be discussed by Dr. Martin Hedges, managing director, Neotech AMT GmbH; Dr. Kai Baer, managing director, adphos Digital Printing GmbH; Dr. Paul Poodt, program manager, Holst Centre;  Coatema Coating Machinery GmbH VP Thomas Kolbusch; and Dr. Marja Vilkman, senior scientist, VTT Technical Research Centre of Finland.
     
    Smart and Hybrid Systems speakers include Francisco Melo, VP/GM Global RFID, Avery Dennison; Prof. Douglas Hackler, president and CEO, American Semiconductor, Inc.; TactoTek CTO Prof. Antti Keränen;  Optomec, Inc. CTO Dr. Michael Renn; and Steven Bagshaw, business development manager, CPI.
     
    As for the Scientific Conference, the concurrent sessions are centered on Printing, Patterning and Equipment and Materials. The morning sessions feature Printing, Patterning and Equipment I and Materials I.
     
    Printing, Patterning and Equipment I will feature talks by Florian Gruber, research assistant, Fraunhofer IWS; Prof. Dr. Tobias Kraus, head, Structure Formation Group; Deputy Head, Innovation Center INM, INM - Leibniz Institute for New Materials GmbH; and Dr. Jürgen Keck, scientific employee, Hahn-Schickard.
     
    Materials I will be covered by Dr. Alexander S. Romanov, senior post-doctoral research associate, School of Chemistry, University of East Anglia; Dr. Angela Digennaro, scientist, CYNORA GmbH; Lukas Stepien, scientific staff, Fraunhofer IWS Dresden; and Michel Molaire, CEO/founder, Molecular Glasses, Inc.
     
    Printing, Patterning and Equipment II will be covered by Henri Fledderus, senior process engineer, Holst Center/ TNO; Christian Röling, application scientist, Accurion GmbH; and Dr. Sebastian Raupp of Karlsruhe Institute of Technology.
     
    Presenters for Materials II include Oliver Miesbauer, scientist, Fraunhofer Institute for Process Engineering and Packaging IVV; Gerhard Domann, head of competence team optics and electronics, Fraunhofer Institut für Silicatforschung; and Dr. Jacob Gavartin, materials science lead, Schrodinger Inc.
     
    Printing, Patterning and Equipment III/Publishing Your Research will have talks by Dr. Ari Alastalo, principal scientist, VTT; Dr. Neil Graddage, research officer, National Research Council Canada; Prof. Dr. Silvia Schintke, professor, head of laboratory of Applied NanoSciences (COMATEC-LANS), HEIG-VD, University of Applied Sciences Western Switzerland; Dr. Young-Sam Park, principal member of engineering staff, ETRI; and Simon Buckmaster, publisher, IOP Publishing.
     
    Materials III will fature talks by Yitzchak (Isaac) Rosen, PhD student, The Hebrew University of Jerusalem; Dr. Arnold Kell, research officer, National Research Council Canada;  Claudia Keibler, projektmanagerin und EU-projektkoordinatorin, Fraunhofer FEP; Dr. Roman Tkachov, researcher, Fraunhofer-Institut für Werkstoff- und Strahltechnik; and Dr. Danick Briand, team leader MEMS and Printed Microsystems, Ecole Polytechnique Fédérale de Lausanne. March 29 then closes with a series of Poster Sessions.
     
    Related Searches
    • vtt
    • semiconductor
    • inc
    • adphos
    Suggested For You
    Gemalto’s Secure Smart Chip to be Integrated in Samsung Galaxy S8 in Selected Markets Gemalto’s Secure Smart Chip to be Integrated in Samsung Galaxy S8 in Selected Markets
    LOPEC 2017 Comes to Successful Conclusion LOPEC 2017 Comes to Successful Conclusion
    LOPEC 2017 Comes to Successful Conclusion LOPEC 2017 Comes to Successful Conclusion
    OE-A Honors Top Demonstrator Projects at LOPEC 2017 OE-A Honors Top Demonstrator Projects at LOPEC 2017
    Growth of Flexible and Printed Electronics is Focus of LOPEC 2017 Growth of Flexible and Printed Electronics is Focus of LOPEC 2017
    Industry Leaders Offer Insights at LOPEC 2017 Business Conference Industry Leaders Offer Insights at LOPEC 2017 Business Conference
    Growth of Flexible and Printed Electronics is Focus of LOPEC 2017 Growth of Flexible and Printed Electronics is Focus of LOPEC 2017
    Industry Leaders Offer Insights at LOPEC 2017 Business Conference Industry Leaders Offer Insights at LOPEC 2017 Business Conference
    Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up
    LOPEC 2017 Highlights Opportunities for Flexible and Printed Electronics LOPEC 2017 Highlights Opportunities for Flexible and Printed Electronics
    Novaled Starts Construction of New Facility in Dresden Novaled Starts Construction of New Facility in Dresden
    LOPEC 2017 Looks to Make Visions a Reality with Printed Electronics LOPEC 2017 Looks to Make Visions a Reality with Printed Electronics
    LOPEC 2017: Printed Electronics for Our Health LOPEC 2017: Printed Electronics for Our Health
    Samsung Makes Significant Move into Quantum Dot Space Samsung Makes Significant Move into Quantum Dot Space

    Related Live From Shows

    • FLEX/MSTC 2020 Focuses on New Applications, Opportunities for FHE

      Presenters highlight the latest developments, research in the world of flexible hybrid electronics and sensors.
      David Savastano, Editor 03.03.20

    • Displays and Lighting | Flexible and Printed Electronics | Manufacturers News | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Sensors and Wearables | Suppliers News
      Scenes from FLEX/MSTC 2020

      Scenes from FLEX/MSTC 2020

      Topics included flexible and hybrid electronics applications, sensors, displays, materials and applications.
      David Savastano, Editor 03.02.20

    • SEMI Industry Strategy Symposium Europe Explores Tech's Role in Region's Most Pressing Needs

      Set for April 1-3, 2020, in Brussels, Belgium.
      03.02.20


    • SEMI-FlexTech Announces 2020 FLEXI Awards Winners

      SEMI-FlexTech Announces 2020 FLEXI Awards Winners

      SEMI-FlexTech, a SEMI Strategic Association Partner, presented the 2020 FLEXI Awards at the 19th annual FLEX 2020 Conference and Exhibition in San Jose, CA.
      02.27.20

    • Advanced Semiconductor Manufacturing Strategies in AI Era to Highlight ASMC 2020

      Advanced Semiconductor Manufacturing Strategies in AI Era to Highlight ASMC 2020

      ASMC 2020 takes place May 4-7, 2020, in Saratoga Springs, NY.
      02.27.20

    • 2020 FLEX/MSTC Examines Present, Looks Toward the Future

      2020 FLEX/MSTC Examines Present, Looks Toward the Future

      Autonomous driving, innovative contact lenses and implantable wearables among the topics as conference opens in San Jose.
      David Savastano, Editor 02.25.20


    • 2020 FLEX/MSTC to Highlight Latest Technologies, Research

      ...
      David Savastano, Editor 02.25.20

    • Volkswagen Joins SEMI

      Volkswagen Joins SEMI

      Volkswagen is a founding member of the SEMI Global Automotive Advisory Council.
      02.25.20

    • SEMI, Partners Launch Largest Microelectronics Education Initiative

      SEMI, Partners Launch Largest Microelectronics Education Initiative

      The initiative is co-funded by Erasmus+ Program.
      02.25.20


    • Breaking News | Semiconductors and Quantum Dots
      North American Semiconductor Equipment Industry Posts January 2020 Billings

      North American Semiconductor Equipment Industry Posts January 2020 Billings

      The billings figure is 5.9% lower than the final December 2019 level of $2.49 billion and is 22.9% higher than the January 2019 billings level of $1.90 billion.
      02.25.20

    • 2020 FLEX/MSTC Begins with Keynote, Concurrent Sessions

      Topics include flexible and hybrid electronics, sensors, displays, materials and applications.
      David Savastano, Editor 02.24.20

    • Tim Brosnihan Appointed Executive Director of SEMI MEMS & Sensors Industry Group

      Tim Brosnihan Appointed Executive Director of SEMI MEMS & Sensors Industry Group

      He will direct MSIG global activities including its R&D, standards, and technical programs.
      02.19.20


    • SEMI President & CEO Ajit Manocha Being Inducted into Silicon Valley Engineering Hall of Fame

      SEMI President & CEO Ajit Manocha Being Inducted into Silicon Valley Engineering Hall of Fame

      SVEC honoring Manocha for 'championing industry collaboration and driving manufacturing efficiency in multiple leadership roles.'
      02.19.20

    • SEMI-FlexTech Launches Six New FHE Projects

      SEMI-FlexTech Launches Six New FHE Projects

      Organizations including UTEP, American Semiconductor, PARC, Tekscan, Alertgy and SAFI-Tech will lead the initiatives.
      02.19.20

    • SEMI Releases Global Semiconductor Equipment Sales Forecast

      SEMI Releases Global Semiconductor Equipment Sales Forecast

      Sales will drop 10.5% to $57.6 billion in 2019 from last year’s historic peak of $64.4 billion but stage a 2020 recovery, per SEMI.
      02.19.20

    Trending
    • Most Intriguing Flexible, Printed Electronics Products Of 2020
    • Nathan Winters Appointed Zebra Technologies CFO
    • Global Printed, Flexible, Hybrid, Textile Electronics Community Gathers Online
    • Rajita D’Souza Appointed STMicroelectronics President, HR, And CSR
    • Roadsimple Modernizes Warehouse Ops With Zebra Technologies
    Breaking News
    • Farmacorp Selects Zebra Technologies, Reflexis Systems to Modernize On-site Store Audits
    • Sensormatic Solutions Debuts VisionWorks at NRF 2021
    • Veridos Paves Way for Secure, Autonomous Border Crossing
    • Rajita D’Souza Appointed STMicroelectronics President, HR, and CSR
    • Phiaro Corporation Incorporates TactoTek IMSE Smart Surfaces into Customer Projects
    View Breaking News >
    CURRENT ISSUE

    Fall 2020

    • Flexible Electronics Is Proving to Be Ideal for Healthcare
    • COVID-19 and the Printed Electronics Industry
    • Smart Packaging Looks to Move Forward
    • Electronic & Conductive Ink Conference Showcases Future of Ink Technology
    • Printed Electronics Now’s International Suppliers’ Directory
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • About Us
    • Privacy Policy
    • Terms And Conditions
    • Contact Us

    follow us

    Subscribe
    Nutraceuticals World

    Latest Breaking News From Nutraceuticals World

    NSF Begins New Certification Program
    Eriocitrin Shown to Have Metabolic Benefits in Recent Study
    EverGrain Introduces Sustainable Barley Ingredients
    Coatings World

    Latest Breaking News From Coatings World

    Zeppelin Acquires MTI Mischtechnik
    Ezio Braggio Joins ChemQuest Europe
    IFS Coatings Announce Carbon Offset Program
    Medical Product Outsourcing

    Latest Breaking News From Medical Product Outsourcing

    Cognito Therapeutics’ Lead Product Receives FDA Breakthrough Device Designation
    Moon Surgical Expands Leadership Team
    Royal Philips Partners with Merck on Fertility Treatments
    Contract Pharma

    Latest Breaking News From Contract Pharma

    Precision Medicine Group Acquires Project Farma
    Charles River Partners with JADE
    Cytiva Delivers Modular Biologics Factory to Lonza
    Beauty Packaging

    Latest Breaking News From Beauty Packaging

    W.S. Badger is Named a ‘150 Top Impact Company’
    Mana Products, Meiyume and RPG Form The Vertical Beauty Alliance
    The Estée Lauder Companies Appoints SVP, New Business Development
    Happi

    Latest Breaking News From Happi

    Amyris Named a Top Social & Environmental Impact Company
    L'Oréal Bans Animal Hair in Brushes
    Ashland Launches Antaron ECo Gel
    Ink World

    Latest Breaking News From Ink World

    Techkon USA, Konica Minolta Partner
    Mondi Celebrates 8 Wins at 2021 WorldStar Packaging Awards
    Scodix Enhances 50+ Million Holiday Cards in North America for 2020 Holiday Season
    Label & Narrow Web

    Latest Breaking News From Label & Narrow Web

    Exhibitor registration opens for virtual.drupa
    FTA planning in-person Forum & INFOFLEX
    Fortis Solutions Group achieves SGP certification
    Nonwovens Industry

    Latest Breaking News From Nonwovens Industry

    Shemesh Adds U.S. Headquarters
    TZMO USA, Special Needs Group Form Partnership
    BAHP Announces 2021 Officers, Board of Directors
    Orthopedic Design & Technology

    Latest Breaking News From Orthopedic Design & Technology

    New Chief Clinical Officer on Board at IncludeHealth
    Cios Flow from Siemen Healthineers Cleared by FDA
    CMS Expedites Breakthrough Device Access; Industry Applauds
    Printed Electronics Now

    Latest Breaking News From Printed Electronics Now

    Roadsimple Modernizes Warehouse Ops with Zebra Technologies
    SOI Industry Consortium Joins SEMI as Strategic Association Partner
    Farmacorp Selects Zebra Technologies, Reflexis Systems to Modernize On-site Store Audits

    Copyright © 2021 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login