The LOPEC 2017 Technical and Scientific Conferences are officially underway today, with a host of leaders from major companies scheduled to speak on topics throughout the printed electronics supply chain.
 
The Plenary Session will begin with Wolfgang Mildner LOPEC general chair and founder and CEO of MSW, who will offer opening remarks.
 
Henri Rajbenbach, project officer and senior expert, European Commission for Communications Networks, Content & Technology, will then discuss “EU Programs for Large Area Electronics: From Research to Innovation Funding.”  Rajbenbach will offer examples of funding and success stories, as well as anticipated results.
 
Next up, Samsung SVP Dr. Sang Yoon Lee will discuss “Printed Electronics in Korea and Future Prospect of Organic Electronics.” Heliatek GmbH CEO Thibaud Le Séguillon will discuss “BiOPV – Building Integrated OPV.” 
 
Concurrently, Dr. Constanze Ranfeld, OE-A’s project manager, will present “Introduction to Printed Electronics with Examples from Automotive.”
 
LOPEC 2017 will then break into three series of four concurrent sessions, with two each from the Technical Conference and Scientific Conference.
 
The Technical Conference features three pairs of concurrent sessions. The two morning sessions cover Energy and Functional Materials. The presenters during Energy include Dr. Martin Pfeiffer, Heliatek GmbH CTO; Prof. Dr. Pim Groen of Holst Centre; Jari Keskinen, project manager, Tampere University of Technology; and IN-CORE Systemes GM Dr. Michel Popovic.
 
Functional Materials will be covered by Dr. Chun-Hao Tu, manager Advanced Device Research Center, AU Optronics; Inkron CEO Dr. Juha Rantala; Aurélie Morley, R&D lead, Merck Chemicals Ltd.; and Dr. Ryan Giedd, director, Device Engineering & Development, Brewer Science, Inc.
 
The early afternoon Technical Conference sessions cover Touch, Tactile and Haptic Feedback and Biomedical Applications.  Speakers during Touch, Tactile and Haptic Feedback include Novasentis CEO Francois Jeanneau; Dr. Wolfgang Clemens, head of product management PolyTC, PolyIC GmbH & Co. KG;  and Bob Mackey, director of biometric architecture, Synaptics.  
 
Biomedical Applications presenters include Dr. Steven Setford, director, Strip Development, Johnson & Johnson, Diabetes Care Companies; Dr. May Wheeler, scientist, Cambridge Display Technology Ltd.; and Giorgio Mutinati, scientist, AIT Austrian Institute of Technology.
 
The final pair of Technical Conference sessions will cover Upscaling Production and Manufacturing Processes and Smart and Hybrid Systems
 
Upscaling Production and Manufacturing Processes will be discussed by Dr. Martin Hedges, managing director, Neotech AMT GmbH; Dr. Kai Baer, managing director, adphos Digital Printing GmbH; Dr. Paul Poodt, program manager, Holst Centre;  Coatema Coating Machinery GmbH VP Thomas Kolbusch; and Dr. Marja Vilkman, senior scientist, VTT Technical Research Centre of Finland.
 
Smart and Hybrid Systems speakers include Francisco Melo, VP/GM Global RFID, Avery Dennison; Prof. Douglas Hackler, president and CEO, American Semiconductor, Inc.; TactoTek CTO Prof. Antti Keränen;  Optomec, Inc. CTO Dr. Michael Renn; and Steven Bagshaw, business development manager, CPI.
 
As for the Scientific Conference, the concurrent sessions are centered on Printing, Patterning and Equipment and Materials. The morning sessions feature Printing, Patterning and Equipment I and Materials I.
 
Printing, Patterning and Equipment I will feature talks by Florian Gruber, research assistant, Fraunhofer IWS; Prof. Dr. Tobias Kraus, head, Structure Formation Group; Deputy Head, Innovation Center INM, INM - Leibniz Institute for New Materials GmbH; and Dr. Jürgen Keck, scientific employee, Hahn-Schickard.
 
Materials I will be covered by Dr. Alexander S. Romanov, senior post-doctoral research associate, School of Chemistry, University of East Anglia; Dr. Angela Digennaro, scientist, CYNORA GmbH; Lukas Stepien, scientific staff, Fraunhofer IWS Dresden; and Michel Molaire, CEO/founder, Molecular Glasses, Inc.
 
Printing, Patterning and Equipment II will be covered by Henri Fledderus, senior process engineer, Holst Center/ TNO; Christian Röling, application scientist, Accurion GmbH; and Dr. Sebastian Raupp of Karlsruhe Institute of Technology.
 
Presenters for Materials II include Oliver Miesbauer, scientist, Fraunhofer Institute for Process Engineering and Packaging IVV; Gerhard Domann, head of competence team optics and electronics, Fraunhofer Institut für Silicatforschung; and Dr. Jacob Gavartin, materials science lead, Schrodinger Inc.
 
Printing, Patterning and Equipment III/Publishing Your Research will have talks by Dr. Ari Alastalo, principal scientist, VTT; Dr. Neil Graddage, research officer, National Research Council Canada; Prof. Dr. Silvia Schintke, professor, head of laboratory of Applied NanoSciences (COMATEC-LANS), HEIG-VD, University of Applied Sciences Western Switzerland; Dr. Young-Sam Park, principal member of engineering staff, ETRI; and Simon Buckmaster, publisher, IOP Publishing.
 
Materials III will fature talks by Yitzchak (Isaac) Rosen, PhD student, The Hebrew University of Jerusalem; Dr. Arnold Kell, research officer, National Research Council Canada;  Claudia Keibler, projektmanagerin und EU-projektkoordinatorin, Fraunhofer FEP; Dr. Roman Tkachov, researcher, Fraunhofer-Institut für Werkstoff- und Strahltechnik; and Dr. Danick Briand, team leader MEMS and Printed Microsystems, Ecole Polytechnique Fédérale de Lausanne. March 29 then closes with a series of Poster Sessions.