David Savastano, Editor11.09.18
Today’s closing session of IDTechEx Live!/Printed Electronics USA 2018 will cover the gamut of new technologies, including flexible and Printed Electronics , sensors, the Internet of Things , wearables, 3D printing, graphene, energy harvesting and electric vehicles, among others.
The Santa Clara Convention Center will feature a wide range of companies, including multinational giants such as Jabil, Qualcomm Life, Hewlett Packard Labs, Bayer and the US Army ARDEC, as well as industry leaders in these fields.
Organized by IDTechEx, PE USA 2018 features eight co-located concurrent programs during its eight tracks, including sessions on Printed Electronics, 3D Printing, Energy Harvesting, Energy Storage Innovations, Graphene, Internet of Things (IoT) Applications, Sensors, and Wearables.
The focus of Track 1 today is 3D Printing. The opening session, Advances with 3D Printing of Polymers, will be covered by Voxel8, Maastricht University, FORECAST 3D, Vision Miner and SHAP3D.
3D Printing of Composites, the next segment, will be discussed by speakers from Markforged, Impossible Objects, Vartega, Arevo Inc. and Studio Michiel Van der Kley. Medical 3D Printing will be covered by Anatomics, Inc., Advanced Solutions, University of the Pacific School of Dentistry, Medicalip and Sutrue. Enabling Technologies for 3D Printing, the closing topic, will feature presenters from Elkem Silicones, HoneyPoint 3D, Tempo Industries and Huafeng.
Track 2 will continue the discussion on Electric Vehicles. Autonomous Vehicles, the opening session, will be discussed by Velodyne LiDAR, Mentor Graphics, Quanergy, Eyeris and Ouster, Inc. Specialty EVs is up next, with presentations from Ampaire, Workhorse Technologies, Romax Technology and IDTechEx.
The session on Charging Infrastructure, V2G and Power Electronics will feature talks from Wolfspeed, A Cree Company, Mojo Mobility, GaN Systems, Polycharge America and MAGMENT UG. Track 2 will close with Second Life Batteries, featuring speakers from IDTechEx, CONNEXX SYSTEMS, Dukosi Limited and FreeWire Technologies.
Track 3 covers Energy Harvesting, with Supercapacitors and High Power Batteries the first session, with speakers from ZapGo Ltd., Nippon Chemicon Corporation, Nanoramic Laboratories, PO-CELLTECH Ltd. and Kilowatt Labs, Inc. on the agenda. Fuel Cells is the next segment, with leaders from Cummins Inc., IDXIE LLC, Enapter, Intelligent Energy and TransPower slated to talk.
In the afternoon, Track 3 bgins with Advanced Battery Materials, with talks by Natron Energy, Lionrock Batteries, Sion Power Corporation, EnZinc and Lawrence Berkeley National Laboratory. Battery Safety Innovations concludes Track 3, with speakers from Electra Vehicles, Enevate Corporation, University of Warwick and IDTechEx.
Track 4 will look at wide range of topics, beginning with Realizing Digital Twinning and Predictive Maintenance, which will be covered by Thermo Fisher Scientific, Veritas Technologies LLC, Manifold, Jabil and Software Design Solutions. Industry 4.0: Smart Manufacturing will be the focus of talks from Instrumental Inc., Software AG, Cumulocity IoT, Porex, Benchmark Electronics and King & Spalding LLP.
After lunch, the RFID session will include talks by RRAIN RFID, Teslonix, Voyantic, Murata Electronics NA and Silent Sensors Limited. Connectivity and Security, the closing segment of Track 4, will be covered by Sigfox USA, BSAC: Berkeley Sensor & Actuator Center, Ericsson and Rambus.
Track 5 starts with Energy Harvesting, with talks by Phillips 66, Saule Technologies, Alta Devices, Wuerth Elektronik eiSos GmbH & Co. KG and Imperial College London. OLED Display Innovations, the next session, will be covered by Visionox, Royole Corporation, Korea Institute of Industrial Technology, OTI Lumionics and Atom Nanoelectronics.
Display and Lighting Innovations starts the afternoon session for Track 5, with speakers from Nth Degree Technologies, CLEARink, Ynvisible, Kent Displays and EMD Performance Materials. Haptics and HMI, the closing session, will be covered by Tangio Printed Electronics, Cambridge Mechatronics Ltd., Ultrahaptics and Novasentis.
Printed electronics will be covered in Track 6, beginning with Smart Packaging and Printed IoT, which will be the focus of speakers from Ahead Of The Curve, PragmatIC, Thin Film Electronics, Toray Industries and PARC, a Xerox company. Hybrid Electronics will then be covered by Hewlett Packard Labs, American Semiconductor, US Army ARDEC, Xerox Research Centre Canada and Muhlbauer.
The afternoon session will begin with a segment on Printed Electronics Material Advances, covered by CondAlign AS, Agfa-Gevaert, Suzhou Nano-Tech and Nano-Bionics, DUKSAN Hi-Metal Co., Ltd. and Heraeus Deutschland GmbH & Co. KG. The closing topic is Printed Electronics Manufacturing, with speakers slated from NovaCentrix, CERADROP, ACI Materials and Applied Materials.
Track 7, which focuses on sensors, begins with Biometric and HMI Sensing Innovations, analyzed by Freer Logic, Synaptics, Emoshape, Peratech and Valencell. Flexible, Printed and Large Area Sensors, the next session, will be covered by FlexEnable, Creative Materials, Arjowiggins, Joanneum Research and Berkeley Sensor & Actuator Center (BSAC).
Structural Health Monitoring for Transportation will be discussed by Acellent Technologies, Quest Integrated (Qi2), Continuous Composites, NextFlex and Intelligent Fiber Optic Systems Corporation. The closing session is RFID and Low Power Sessions, with leaders from Powercast Corporation, Infratab, Alpha Szenszor and PST Sensors on hand to offer their insights.
Wearables are the focus of Track 8, beginning with Wearables in Healthcare, which will be covered by Bayer, Bonbouton, Tarilian Laser Technologies, Qualcomm Life and LifeSense Group. Towards Wearables in Consumer Healthcare will be discussed by speakers from VivaLnk, Maxim Integrated, AuSense Technologies, WL Gore and Motiv.
Track 8 resumes in the afternoon with Elite Sports Analytics with Wearable Devices, which will be covered by leaders from PUSH, Victorise, StretchSense, Asensei and Halo Neuroscience. Track 8 concludes with Wearable Devices in the Workplace, with talks by Panasonic, Contextere, Proceedix and Tacterion GmbH.
The Santa Clara Convention Center will feature a wide range of companies, including multinational giants such as Jabil, Qualcomm Life, Hewlett Packard Labs, Bayer and the US Army ARDEC, as well as industry leaders in these fields.
Organized by IDTechEx, PE USA 2018 features eight co-located concurrent programs during its eight tracks, including sessions on Printed Electronics, 3D Printing, Energy Harvesting, Energy Storage Innovations, Graphene, Internet of Things (IoT) Applications, Sensors, and Wearables.
The focus of Track 1 today is 3D Printing. The opening session, Advances with 3D Printing of Polymers, will be covered by Voxel8, Maastricht University, FORECAST 3D, Vision Miner and SHAP3D.
3D Printing of Composites, the next segment, will be discussed by speakers from Markforged, Impossible Objects, Vartega, Arevo Inc. and Studio Michiel Van der Kley. Medical 3D Printing will be covered by Anatomics, Inc., Advanced Solutions, University of the Pacific School of Dentistry, Medicalip and Sutrue. Enabling Technologies for 3D Printing, the closing topic, will feature presenters from Elkem Silicones, HoneyPoint 3D, Tempo Industries and Huafeng.
Track 2 will continue the discussion on Electric Vehicles. Autonomous Vehicles, the opening session, will be discussed by Velodyne LiDAR, Mentor Graphics, Quanergy, Eyeris and Ouster, Inc. Specialty EVs is up next, with presentations from Ampaire, Workhorse Technologies, Romax Technology and IDTechEx.
The session on Charging Infrastructure, V2G and Power Electronics will feature talks from Wolfspeed, A Cree Company, Mojo Mobility, GaN Systems, Polycharge America and MAGMENT UG. Track 2 will close with Second Life Batteries, featuring speakers from IDTechEx, CONNEXX SYSTEMS, Dukosi Limited and FreeWire Technologies.
Track 3 covers Energy Harvesting, with Supercapacitors and High Power Batteries the first session, with speakers from ZapGo Ltd., Nippon Chemicon Corporation, Nanoramic Laboratories, PO-CELLTECH Ltd. and Kilowatt Labs, Inc. on the agenda. Fuel Cells is the next segment, with leaders from Cummins Inc., IDXIE LLC, Enapter, Intelligent Energy and TransPower slated to talk.
In the afternoon, Track 3 bgins with Advanced Battery Materials, with talks by Natron Energy, Lionrock Batteries, Sion Power Corporation, EnZinc and Lawrence Berkeley National Laboratory. Battery Safety Innovations concludes Track 3, with speakers from Electra Vehicles, Enevate Corporation, University of Warwick and IDTechEx.
Track 4 will look at wide range of topics, beginning with Realizing Digital Twinning and Predictive Maintenance, which will be covered by Thermo Fisher Scientific, Veritas Technologies LLC, Manifold, Jabil and Software Design Solutions. Industry 4.0: Smart Manufacturing will be the focus of talks from Instrumental Inc., Software AG, Cumulocity IoT, Porex, Benchmark Electronics and King & Spalding LLP.
After lunch, the RFID session will include talks by RRAIN RFID, Teslonix, Voyantic, Murata Electronics NA and Silent Sensors Limited. Connectivity and Security, the closing segment of Track 4, will be covered by Sigfox USA, BSAC: Berkeley Sensor & Actuator Center, Ericsson and Rambus.
Track 5 starts with Energy Harvesting, with talks by Phillips 66, Saule Technologies, Alta Devices, Wuerth Elektronik eiSos GmbH & Co. KG and Imperial College London. OLED Display Innovations, the next session, will be covered by Visionox, Royole Corporation, Korea Institute of Industrial Technology, OTI Lumionics and Atom Nanoelectronics.
Display and Lighting Innovations starts the afternoon session for Track 5, with speakers from Nth Degree Technologies, CLEARink, Ynvisible, Kent Displays and EMD Performance Materials. Haptics and HMI, the closing session, will be covered by Tangio Printed Electronics, Cambridge Mechatronics Ltd., Ultrahaptics and Novasentis.
Printed electronics will be covered in Track 6, beginning with Smart Packaging and Printed IoT, which will be the focus of speakers from Ahead Of The Curve, PragmatIC, Thin Film Electronics, Toray Industries and PARC, a Xerox company. Hybrid Electronics will then be covered by Hewlett Packard Labs, American Semiconductor, US Army ARDEC, Xerox Research Centre Canada and Muhlbauer.
The afternoon session will begin with a segment on Printed Electronics Material Advances, covered by CondAlign AS, Agfa-Gevaert, Suzhou Nano-Tech and Nano-Bionics, DUKSAN Hi-Metal Co., Ltd. and Heraeus Deutschland GmbH & Co. KG. The closing topic is Printed Electronics Manufacturing, with speakers slated from NovaCentrix, CERADROP, ACI Materials and Applied Materials.
Track 7, which focuses on sensors, begins with Biometric and HMI Sensing Innovations, analyzed by Freer Logic, Synaptics, Emoshape, Peratech and Valencell. Flexible, Printed and Large Area Sensors, the next session, will be covered by FlexEnable, Creative Materials, Arjowiggins, Joanneum Research and Berkeley Sensor & Actuator Center (BSAC).
Structural Health Monitoring for Transportation will be discussed by Acellent Technologies, Quest Integrated (Qi2), Continuous Composites, NextFlex and Intelligent Fiber Optic Systems Corporation. The closing session is RFID and Low Power Sessions, with leaders from Powercast Corporation, Infratab, Alpha Szenszor and PST Sensors on hand to offer their insights.
Wearables are the focus of Track 8, beginning with Wearables in Healthcare, which will be covered by Bayer, Bonbouton, Tarilian Laser Technologies, Qualcomm Life and LifeSense Group. Towards Wearables in Consumer Healthcare will be discussed by speakers from VivaLnk, Maxim Integrated, AuSense Technologies, WL Gore and Motiv.
Track 8 resumes in the afternoon with Elite Sports Analytics with Wearable Devices, which will be covered by leaders from PUSH, Victorise, StretchSense, Asensei and Halo Neuroscience. Track 8 concludes with Wearable Devices in the Workplace, with talks by Panasonic, Contextere, Proceedix and Tacterion GmbH.
