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Revolutionary Chip Scale Packaging Enabling Reliably Thin Electronics
American Semiconductor designs, manufactures, and integrates ultra-thin electronic chips (technically called flexible integrated circuits – FleX™ IC’s) to enable the flexible hybrid electronics (FHE) while also enabling traditional electronic applications to dramatically reduce product thickness creating smart-labels and smart-structure products. The proprietary Chip Scale Packaging (CSP) technology that makes FleX™ ICs possible is Semiconductor-on-Polymer (SoP). SoP interest and adoption is developing due to SoP’s capability to provide improved reliability for ultra-thin applications.
Visit us at LOPEC 2019 Hall BO Booth# 312
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